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1 день назад

Sr. Principal Engineer, Manufacturing Infrastructure (Semiconductor)

158 600 - 234 650$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Мэтч & Сопровод

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Описание вакансии

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TL;DR

Sr. Principal Engineer, Manufacturing Infrastructure (Semiconductor): Orchestrating the development and validation of automated test architectures for next-generation silicon and optical technologies with an accent on high-volume manufacturing (HVM) readiness. Focus on bridging the gap between R&D and production by leading cross-functional teams in thermal, mechanical, and photonic integration for complex hardware systems.

Location: Must be based in Westlake Village, CA or Santa Clara, CA

Salary: $158,600 - $234,650 per annum

Company

hirify.global is a leading semiconductor solutions provider enabling the data infrastructure that connects cloud, AI, and enterprise architectures.

What you will do

  • Orchestrate end-to-end integration of complex infrastructure programs to ensure on-time transition to high-volume manufacturing.
  • Drive technical milestones for test hardware development, specifically for KGD, CPO, and CPC solutions.
  • Act as the central integration lead between thermal, mechanical, photonic, and signal integrity teams.
  • Translate customer roadmaps into actionable internal engineering schedules and technology readiness plans.
  • Manage global deployment of test architectures from wafer sort through system-level test.
  • Optimize manufacturing yield, repeatability, and throughput through direct technical feedback on test vehicles.

Requirements

  • Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Physics or equivalent.
  • 15+ years of relevant experience in Product Engineering, Mechanical Design, and Systems Integration.
  • Proven success in executing technology transfers from R&D to HVM environments.
  • Experience in testing silicon photonics, photonic interposers, and high-speed interconnects.
  • Must be eligible to access export-controlled information under U.S. export control laws.
  • Mastery of project management methodologies for complex hardware development.

Culture & Benefits

  • Comprehensive financial well-being programs including an employee stock purchase plan with a 2-year look back.
  • Robust family support programs and work-life balance initiatives.
  • Extensive mental and physical health resources.
  • Recognition and service awards to celebrate professional milestones.
  • Opportunity to influence the architecture of world-class, high-density hardware.

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