Packaging Module Development Engineer (Semiconductor)

TL;DR

Packaging Module Development Engineer (Semiconductor): Developing packaging materials technology for co-packaged optical semiconductor assemblies with an accent on optical materials and assembly processes. Focus on characterizing materials, collaborating with suppliers for formulation, and implementing novel concepts for future assembly packaging platforms.

Location: On-site in Phoenix, Arizona, USA

Salary: $115,110–$219,550

Company

hirify.global Foundry focuses on state-of-the-art semiconductor manufacturing, delivering cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Conduct fundamental studies and experiments to characterize materials and identify potential failure modes.
• Collaborate with materials suppliers to develop formulations meeting technology, quality, and cost targets.
• Build material technologies on test vehicles and products in collaboration with process engineering teams.
• Develop assembly processes and equipment using novel concepts for future packaging platform technologies.
• Create new metrologies and quality screens to ensure early identification of packaging quality and reliability issues.

Requirements

• MS with 3+ years of experience or PhD with 1+ years of post-graduation work experience.
• Degree in Optics/Photonics Engineering, Materials Science, Applied Physics, Chemical Engineering, or related fields.
• Must be based in or able to work on-site in Phoenix, Arizona.

Nice to have

• Experience in semiconductor packaging and optical assembly.
• Expertise in optical connector/component design and manufacturing.
• Experience with photolithography materials and processes.
• Knowledge of ceramics and glass processing.

Culture & Benefits

• Competitive total compensation package ranking among the best in the industry.
• Stock bonuses.
• Comprehensive benefit programs including health, retirement, and vacation.