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2 дня назад

Module Development Engineer

99 030 - 188 890$
Формат работы
onsite
Тип работы
fulltime
Грейд
junior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify RU Global, списка компаний с восточно-европейскими корнями
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Описание вакансии

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TL;DR

Module Development Engineer (Semiconductor): Develop and optimize defect inspection tools and advanced manufacturing processes with an accent on material selection, parameter optimization, equipment metrology, and system design. Focus on leading feasibility studies, implementing defect inspection technologies, partnering with suppliers, and shaping cost-efficient technology roadmaps.

Location: On-site presence required in Hillsboro, Oregon, US

Salary: $99,030 - $188,890

Company

hirify.global Foundry, delivering state-of-the-art semiconductor process and packaging technology for AI products with global manufacturing scale.

What you will do

  • Design, develop, and optimize manufacturing processes including material selection, equipment metrology, and system design.
  • Lead feasibility studies and pathfinding for next-generation device architectures.
  • Develop defect inspection technologies for high-volume manufacturing.
  • Partner with equipment and material suppliers to implement enabling technologies.
  • Recommend modifications to improve equipment performance and production efficiency.
  • Conduct process feasibility studies using simulations and engineering methods.

Requirements

  • Bachelor's in Mechanical Engineering, Electrical Engineering or STEM with 1+ years relevant experience
  • Technical expertise in semiconductor processing, system controls, opto-mechanics, or mechanical systems
  • Proficiency in Statistical Process Control (SPC) and Design of Experiments (DOE)
  • Programming in Python or MATLAB
  • Hands-on experience with robotics, automation, vision systems, or image processing
  • Not eligible for hirify.global immigration sponsorship

Nice to have

  • Master's or PhD in Mechanical/Electrical Engineering or STEM
  • Experience in Advanced Packaging
  • Troubleshooting manufacturing processes and equipment
  • Packaging processes, equipment automation, or project management

Culture & Benefits

  • Competitive pay, stock bonuses, health, retirement, and vacation benefits
  • Opportunity to innovate in semiconductor technology and collaborate globally
  • Part of worldwide factory network focused on yield improvements and advanced packaging

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