Package Assembly Low Yield Analysis Engineer (Semiconductors)

TL;DR

Package Assembly Low Yield Analysis Engineer (Semiconductors): Root cause yield loss and in-line failures in back-end package assembly and wafer level assembly with an accent on electrical characterization and defect analysis. Focus on conducting hands-on lab work, designing data acquisition strategies, and developing failure analysis techniques to accelerate mechanism understanding.

Location: On-site in Phoenix, Arizona, US

Salary: $99,030–$162,500

Company

A global leader in semiconductor manufacturing, focusing on cutting-edge silicon process and packaging technology for the AI era.

What you will do

• Perform root cause determination of in-line electrical failures and process characterization for assembly technologies.
• Conduct hands-on lab work, define data acquisition strategies, and recommend corrective actions to internal customers.
• Develop innovative failure analysis techniques and Best Known Methods (BKMs) to accelerate mechanism understanding.
• Collaborate with internal teams and external suppliers to improve yield and drive innovation in semiconductor assemblies.
• Provide technical consultation regarding packaging and assembly problems in the manufacturing process.
• Translate program milestones and schedules into team objectives and drive execution.

Requirements

• Education: Master's Degree or higher in Materials Science, Mechanical, Chemical, or Electrical Engineering, Chemistry, Physics, or a related field.
• Experience: 3+ months with electron microscopy tools (SEM, PEM) or other fault isolation tools.
• Schedule: Must be able to work Shift 7 (Compressed Days Back half of the week).
• Location: Must be based in or able to work on-site in Phoenix, Arizona.
• Strong analytical, problem-solving, and communication skills.

Nice to have

• Experience with destructive/optical analysis (cross-sectioning, delayering, x-ray, CSAM, ion milling, TEM, FIB).
• Experience with electrical fault isolation (hand probe, curve trace, TDR, EBAC, RIDR, ELITE).
• Knowledge of chemical compositional analysis (EDX, AFM, FTIR, Raman) or diffraction techniques (XRD, EBSD).
• Proficiency with package/die mapping software (Mentor Graphics, SysNav/CadNav, FIELD), SQL scripting, and JMP.

Culture & Benefits

• Competitive total rewards package including salary and stock bonuses.
• Comprehensive health, retirement, and vacation benefits.
• Opportunity to work in a state-of-the-art Foundry Labs Network environment.
• Collaborative culture focusing on inclusive work environments and professional growth.