Advanced Packaging Multi-Physics Modeling Engineer (Hardware)

TL;DR

Advanced Packaging Multi-Physics Modeling Engineer (Hardware): Leading multi-physics modeling and simulation for next-generation AI/HPC advanced packaging systems with an accent on co-optimization of thermal, mechanical, and electrical interactions. Focus on developing simulation methodologies for heterogeneous integration platforms and performing reliability assessments for complex package architectures.

Location: San Francisco, Must meet U.S. export control laws and regulations

Salary: $342K – $445K + Equity

Company

hirify.global is an AI research and deployment company dedicated to ensuring that general-purpose artificial intelligence benefits all of humanity.

What you will do

• Lead multi-physics modeling and simulation across thermal, mechanical, and electrical domains for AI/HPC packaging systems.
• Drive co-optimization of chip, package, and system interactions to improve power integrity and thermal performance.
• Develop and validate electro-thermal-mechanical simulation methodologies for 2.5D/3D packaging, HBM integration, and chiplet architectures.
• Perform reliability assessments and root-cause analysis for package warpage, stress, and thermo-mechanical failures.
• Correlate simulation results with physical hardware measurements and reliability test data to improve design predictability.

Requirements

• Strong experience in thermal and mechanical modeling for advanced packaging systems.
• Proficiency with finite element analysis (FEA) and tools such as ANSYS, COMSOL, Abaqus, or Icepak.
• Deep knowledge of package reliability mechanisms including solder fatigue, underfill stress, and electromigration.
• Solid understanding of electro-thermal interactions and temperature-dependent electrical behavior.
• Legal status meeting U.S. export control laws and regulations.

Nice to have

• MS or PhD in Mechanical Engineering, Electrical Engineering, Materials Science, or Physics.
• Familiarity with advanced packaging technologies such as CoWoS, EMIB, and 3D stacking.
• Strong technical leadership and cross-functional collaboration skills.

Culture & Benefits

• Opportunity to influence real product architecture decisions for cutting-edge AI hardware.
• Work on some of the most advanced AI/HPC packaging technology in the industry.
• Collaborative environment working closely with software and research partners to co-design hardware.
• Equity offers as part of the compensation package.