Senior ASIC Package Design Engineer

TL;DR

Senior ASIC Package Design Engineer (FC-BGA/MCM): Define ASIC package architecture for high-pin-count, high-performance mixed-signal SoCs with an accent on substrate stack-up, power delivery, signal breakout, and mechanical constraints. Focus on leading package-level trade studies across cost, SI/PI, thermal, and reliability, co-optimizing die floorplans with silicon/RF/systems teams, and driving production ramp with OSATs.

Location: United States - Remote. U.S. Person required (ITAR export compliance: U.S. citizens, permanent residents, or protected individuals)

Salary: $180,000 – $260,000 + equity

Company

Building the largest and highest-power satellites for LEO to deep space, backed by $450M+ from top investors, with mass production and launches planned through 2026-2027.

What you will do

• Define package architecture for FC-BGA and MCM solutions, including stack-up, ball-map, power delivery, signal breakout, and mechanical constraints.
• Lead trade studies on cost, performance, PI/SI, thermal, manufacturability, and reliability.
• Drive detailed design of high-pin-count packages with high-speed SerDes, dense power grids, and RF signals.
• Partner with silicon, RF, and systems teams to co-optimize die floorplans and interfaces.
• Support SI/PI/thermal strategies, material selection, and assembly optimization.
• Establish design standards, methodologies, and best practices for first-pass success.

Requirements

• Bachelor’s in Packaging, Mechanical, Electrical Engineering or related.
• 5+ years in ASIC package design with deep FC-BGA expertise.
• Proven delivery of high-pin-count, high-performance packages to production.
• Strong knowledge of substrate technologies, SI/PI fundamentals, thermal management.
• Fluent in SI/PI/EM tools: SIWave, HFSS, ADS.
• Experience with OSATs, substrate vendors, packaging qualification.
• U.S. Person status per ITAR (citizens, green card holders, protected individuals)

Nice to have

• MCM or heterogeneous integration (chiplets, interposers).
• High-speed digital/mixed-signal SoCs background.
• Aerospace, space, or high-reliability electronics experience.

Culture & Benefits

• Comprehensive benefits: PTO, medical/dental/vision, life insurance, paid parental leave.
• Equity in Series C space startup.
• Fast-paced environment for motivated individuals building groundbreaking spacecraft.
• Encourages non-traditional career paths; apply even if not 100% match.