Назад
Company hidden
16 часов назад

Principal ASIC Package Design Engineer (Aerospace)

200 000 - 280 000$
Формат работы
remote (только USA)
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
Для мэтча и отклика нужен Plus

Мэтч & Сопровод

Для мэтча с этой вакансией нужен Plus

Описание вакансии

Текст:
/

TL;DR

Principal ASIC Package Design Engineer (Aerospace): Designing and owning the end-to-end ASIC package architecture for high-performance mixed-signal and digital SoCs with an accent on FC-BGA and MCM solutions. Focus on optimizing power delivery, signal integrity, and thermal management for power-dense ASICs in satellite systems.

Location: Remote (Must be a U.S. Person per ITAR regulations)

Salary: $200,000 – $280,000 + equity

Company

hirify.global is a Series C startup building high-power satellite platforms to enable deep space missions and develop the solar system.

What you will do

  • Own ASIC package architecture for FC-BGA and MCM, including substrate stack-up and ball-map strategy.
  • Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), and thermal constraints.
  • Define the long-term packaging roadmap for future ASIC nodes and multi-die integration.
  • Drive detailed design of high-pin-count packages with high-speed SerDes and RF signal content.
  • Collaborate with silicon, RF, and systems teams to optimize die floorplans and package interfaces.
  • Manage technical relationships with substrate vendors, assembly houses, and OSATs.

Requirements

  • Bachelor’s degree in Packaging, Mechanical, or Electrical Engineering.
  • 10+ years of experience in ASIC package design with deep FC-BGA expertise.
  • Proven track record of delivering high-performance ASIC packages into production.
  • Proficiency in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS.
  • Must be a "U.S. Person" (Citizen, Green Card holder, etc.) to comply with ITAR regulations.

Nice to have

  • Experience with MCM or heterogeneous integration (chiplets, interposers).
  • Background in high-speed digital or mixed-signal SoCs.
  • Familiarity with aerospace, space, or high-reliability electronics.

Culture & Benefits

  • Competitive base salary with equity in the company.
  • Comprehensive health package including medical, dental, and vision coverage.
  • Paid time off and paid parental leave.
  • Opportunity to work at a fast-paced, groundbreaking space startup.

Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →