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2 часа назад

Principal Application Engineer Lead (Semiconductor)

180 000 - 240 000$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Principal Application Engineer Lead (Semiconductor HW & SW): Integrating high-performance Ethernet solutions into advanced hardware and software systems for automotive, robotics, and Physical AI platforms with an accent on system integration and high-speed networking. Focus on solving complex connectivity challenges, debugging sensor fusion, and driving designs from concept to silicon for autonomous systems.

Location: Hybrid-based in San Jose, CA

Salary: $180,000 - $240,000

Company

hirify.global is developing the future of Ethernet-based networks to realize the full potential of software-defined and autonomous vehicles, robotics, and other intelligent machines.

What you will do

  • Interface between the field team and internal hardware, software, and architecture teams.
  • Support customer designs from early concept and development through validation and production.
  • Solve complex system integration challenges involving high-speed networking, sensor connectivity, and AI compute platforms.
  • Create design collateral and provide technical customer support and system bring-up.
  • Debug integration efforts across Automotive and Robotics applications, including sensor fusion and AI-driven platforms.

Requirements

  • 10+ years of embedded development experience with a focus on both hardware and software.
  • Hands-on design experience with Ethernet PHYs, Ethernet switches, or PCIe.
  • Automotive experience at Tier 1, Tier 2, or OEM level.
  • B.S. or M.S. in Electrical Engineering.
  • Location: Must be based in San Jose, CA (Hybrid).

Nice to have

  • Understanding of embedded software drivers and OSI network layers 2+.
  • Experience with IEEE802.1 and TSN protocols.
  • Experience with PCIe protocols and topologies.
  • Knowledge of high-speed PCB board design, layout, and routing constraints.
  • Experience with ROS/ROS2, Isaac Sim, or CUDA.

Culture & Benefits

  • Pre-IPO stock options.
  • Competitive base salary and performance bonuses.
  • Medical, dental, and vision insurance for employees.
  • Flexible working hours.
  • Opportunity to grow within a world-class team using cutting-edge technology.

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