Senior Yield Engineer (Substrate & Advanced Packaging)

TL;DR

Senior Yield Engineer (Substrate & Advanced Packaging): Leading process development and yield optimization for advanced semiconductor packaging technology with an accent on data-driven insights and statistical analysis. Focus on resolving critical yield limiters, developing automated analytical workflows, and ensuring manufacturability for next-generation computing products.

Location: On-site in Phoenix, Arizona, USA

Salary: $133,800 - $255,200

Company

hirify.global Foundry Group focuses on state-of-the-art semiconductor manufacturing and packaging technology to enable leadership products for the AI era.

What you will do

• Lead process development initiatives across technology node lifecycles to identify and resolve critical yield limiters.
• Perform advanced statistical analysis and create data visualizations to build process development roadmaps.
• Develop innovative systems to consolidate and analyze big data for defect mode understanding and yield modeling.
• Synthesize large volumes of fabrication and electrical data using machine learning and advanced coding techniques.
• Collaborate with design and test teams to debug yield limiters and ensure manufacturability before manufacturing ramp.
• Create multivariate algorithms and measurement recipes for rapid feedback on product integrity and quality.

Requirements

• Master's degree in Materials Science, Mechanical/Chemical/Electrical Engineering, Chemistry/Physics or related field with 5+ years of experience (or PhD with 3+ years).
• 3+ years of experience using engineering analysis tools, data analysis techniques, and scripting languages like Python to automate workflows.
• 3+ years of experience with logic or substrate manufacturing process flows, including yield analysis or process optimization.
• 3+ years of experience performing commonality analysis and large-scale data analytics using JMP, SQL, and Python.
• Must be based in or able to work on-site in Phoenix, AZ.

Nice to have

• Experience in integration, yield, LYA, FA, test, sort, defect metrology, or QNR.

Culture & Benefits

• Competitive total compensation package including base pay and stock bonuses.
• Comprehensive benefit programs covering health, retirement, and vacation.
• Support for employees and their families through every stage of life.
• Work environment focused on semiconductor innovation and breakthrough technologies.