Principal Engineer (Advanced Packaging)

TL;DR

Principal Engineer (Advanced Packaging): Developing and maturing advanced packaging technologies for data infrastructure with an accent on 2.5D/3D integration and chiplet topology. Focus on co-designing silicon, package, and system architectures to optimize performance, power, and area.

Location: Chandler, AZ (Onsite)

Salary: $168,400 - $249,310 per annum

Company

hirify.global provides semiconductor solutions that serve as the essential building blocks for enterprise, cloud, and AI data infrastructure.

What you will do

• Develop and mature advanced packaging technologies from initial concept to production-ready solutions.
• Define and implement package architectures, including chiplet topology, interconnect strategy, and power delivery networks.
• Establish and refine design rules, stack-ups, and integration guidelines for advanced packaging technologies.
• Collaborate with OSATs, foundries, and substrate suppliers to ensure process capability, yield, and cost targets.
• Lead the development of test vehicles and engineering builds to validate technology readiness and reliability.
• Drive cross-functional efforts across design, product engineering, and supply chain for successful technology deployment.

Requirements

• Deep expertise in 2.5D/3D integration, chiplets, interposers, and advanced substrates.
• Strong foundation in electrical engineering, specifically Signal Integrity (SI), Power Integrity (PI), and electromagnetic behavior.
• Proven experience in technology development and productization (not just design or research).
• Bachelor’s degree with 10+ years of experience, or Master’s/PhD with 8+ years in relevant fields.
• Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Culture & Benefits

• Employee stock purchase plan with a 2-year look back.
• Comprehensive financial well-being and retirement support.
• Robust mental health resources and family support programs to balance work and home life.
• Recognition and service awards to celebrate professional milestones.