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3 часа назад

Principal Engineer (Advanced Package Technology)

168 400 - 249 310$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR

Principal Engineer (Advanced Package Technology): Developing packaging technology roadmaps for AI XPU and networking solutions with an accent on signal, power, and thermal integrity. Focus on designing 2.5D/3D packages, optimizing chiplet topology, and collaborating with OSAT/foundry partners to ensure volume readiness.

Location: Chandler, AZ; Austin, TX; Santa Clara, CA

Salary: $168,400 - $249,310 per annum

Company

hirify.global provides semiconductor solutions that serve as essential building blocks for data infrastructure across enterprise, cloud, and AI architectures.

What you will do

  • Develop packaging technology roadmaps for AI XPU, XPU-attach, and Switch solutions.
  • Define package architecture, including chiplet topology, interposer/substrate scaling, and power delivery network strategies.
  • Lead co-design efforts across silicon design, floorplanning, PDN modeling, and mechanical/thermal reliability.
  • Partner with OSATs and Foundry partners to evaluate process capability, manufacturability, yield, and cost.
  • Create new package technology concepts and protect IP to maximize system performance.

Requirements

  • Bachelor's, Master's, or PhD in Electrical Engineering, Mechanical Engineering, Material Science, or related fields.
  • Extensive professional experience (15+ years for BS, 12+ for MS, 8+ for PhD) in advanced package and substrate technologies.
  • Deep knowledge of signal and power integrity simulations for 2.5D and 3D packages.
  • Mastery of tools including Cadence Sigrity (PowerSI), Ansys HFSS, SIwave, and Cadence Clarity.
  • Must be eligible to access export-controlled information under U.S. export control laws (EAR).

Nice to have

  • Experience in data center AI accelerators, networking silicon, or custom HPC silicon.
  • Knowledge of silicon disaggregation and reaggregation and memory integration.
  • Experience with VNA and TDR measurements for package and PCB characterization.
  • Proven leadership in driving cross-company supplier programs.

Culture & Benefits

  • Comprehensive financial well-being programs, including an employee stock purchase plan with a 2-year look back.
  • Robust support for family, mental health, and physical health.
  • Recognition and service awards to celebrate professional milestones.
  • Commitment to inclusive hiring practices and diversity.

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