Substrate Packaging Research and Development Engineer (Semiconductor)

TL;DR

Substrate Packaging Research and Development Engineer (Semiconductor): Driving innovation and manufacturing excellence in integrated circuit miniaturization with an accent on high-volume manufacturing equipment and process optimization. Focus on implementing production efficiencies, reducing defectivity, and transferring cutting-edge packaging technologies to global manufacturing sites.

Location: On-site presence required in Phoenix, Arizona, US

Salary: $103,730 - $198,820

Company

hirify.global Foundry develops state-of-the-art semiconductor manufacturing and packaging technology to enable leadership products for the AI era.

What you will do

• Own and optimize high-volume manufacturing equipment and processes to meet safety, quality, and cost goals.
• Conduct tests and measurements of equipment operations to ensure critical dimension control and defectivity standards.
• Recommend and implement modifications to improve production techniques and efficiencies for existing products.
• Lead continuous improvement projects focused on yield enhancement and defect reduction.
• Collaborate with equipment suppliers to address technical challenges and improve performance.
• Manage equipment installation, conversion, and qualification during factory ramps.

Requirements

• Master's in Chemical Engineering, Material Science, Chemistry, Physics, or any STEM field with 3+ years of experience.
• Alternatively, a PhD degree in Chemical Engineering, Material Science, Chemistry, Physics, or any STEM field.
• Practical experience with Design of Experiments (DOE) principles.
• Proficiency in structured problem-solving methodologies.
• Must be able to work on-site in Phoenix, Arizona.

Nice to have

• Expertise in statistical process control and process characterization techniques.
• Experience in liquid chemistry and/or lithography process development.
• Advanced knowledge of material science applied to semiconductor manufacturing.
• Experience leading group problem-solving initiatives in high-volume production environments.

Culture & Benefits

• Total compensation package including competitive pay and stock bonuses.
• Comprehensive benefit programs including health, retirement, and vacation.
• Opportunity to work within a worldwide factory network shaping the future of compute devices.