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7 дней назад

DataPUPS Early ID Summit (Software Engineering)

Формат работы
onsite
Тип работы
project
Грейд
trainee
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

DataPUPS Early ID Summit (Software Engineering): A one-day in-office experience for rising sophomores to explore technology roles at hirify.global with an accent on technical workshops and professional networking. Focus on learning how engineering teams build and scale real systems and gaining insights into future internship recruiting.

Location: In-person at hirify.global’s NYC HQ (New York, USA)

Company

hirify.global is a global SaaS business that provides cloud monitoring and infrastructure observability to enable digital transformation for organizations of all sizes.

What you will do

  • Participate in hands-on technical workshops led by hirify.global engineers.
  • Attend engineering talks and product deep dives focused on real production challenges.
  • Learn about career growth and team selection from early-career and senior employees.
  • Gain a transparent overview of the internship recruiting timeline and interview expectations.
  • Connect directly with engineers and product leaders in small-group settings.

Requirements

  • Currently enrolled in a Bachelor’s program (Computer Science or related) graduating in 2029.
  • Able to attend in person in NYC on June 22–23, 2026.
  • Experience with at least one programming language (e.g., Python, Java, Go, C/C++, JavaScript).
  • Strong interest in technical problem-solving and system scalability.
  • CV/resume must be submitted in English.

Nice to have

  • Experience building personal technical projects for fun.
  • Participation in hackathons, coding competitions, or technical research.
  • Interest in exploring future opportunities in New York City or Boston.

Culture & Benefits

  • Travel support details provided for selected participants.
  • Direct access to mentorship and networking with professional engineering teams.
  • Potential for early access to future internship opportunities.
  • Opportunity to join a collaborative, pragmatic, and people-first community.

Hiring process

  • Application-based selection based on CV/resume review.
  • Selected participants are invited to the summit in June 2026.

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