Module Development Engineer (CMP)

TL;DR

Module Development Engineer (CMP): Developing and sustaining planarization techniques for semiconductor materials and architectures with an accent on process integration and equipment solutions. Focus on driving technology enablement for high volume manufacturing, performing pathfinding activities, and optimizing production output.

Location: Hybrid (Hillsboro, Oregon, US)

Salary: $133,800 – $255,200

Company

hirify.global is a global leader in computing technology and semiconductor manufacturing, focusing on the next generation of technologies for the AI era.

What you will do

• Drive technology development and enablement for high volume manufacturing and future technologies.
• Lead the design and development of manufacturing processes, including material selection and parameter optimization.
• Perform pathfinding activities and develop roadmaps for innovative device architectures.
• Recommend and implement equipment modifications to improve production efficiency and output.
• Collaborate with equipment and materials suppliers to implement enabling technology elements.
• Conduct feasibility studies using theoretical simulations and practical engineering methods.

Requirements

• Bachelor's degree in Materials Science, Chemical Engineering, Chemistry, Physics, Electrical Engineering, or a related STEM field.
• 5+ years of Semiconductor Industry experience (for Bachelor's), 4+ for Master's, or 1+ for PhD.
• Expertise in semiconductor processing and fabrication.
• Must be based in or able to work on-site/hybrid in Hillsboro, Oregon.

Nice to have

• PhD degree in a relevant STEM field.
• Direct experience in Chemical Mechanical Planarization (CMP) process development with hands-on tuning.
• Experience with major CMP equipment platforms such as AMAT or Ebara.
• Knowledge of CMP consumables including slurries, pads, conditioning disks, and filters.

Culture & Benefits

• Competitive total compensation package including stock bonuses.
• Comprehensive health, retirement, and vacation programs.
• Hybrid work model allowing employees to split time between on-site and off-site work.
• Opportunity to work with state-of-the-art semiconductor manufacturing and packaging technology.