Defect Characterization Low Yield Analysis Engineering Technician

TL;DR

Defect Characterization Low Yield Analysis Engineering Technician (Semiconductor): Performs material and defect characterization to support backend package assembly and substrate manufacturing yield improvement with an accent on physical and technical failure analysis using advanced characterization techniques. Focus on identifying root causes of inline yield loss, operating laboratory tools like SEM, EDX, X-ray, and FIB, and documenting findings for process improvements.

Location: On-site presence required in Phoenix, Arizona, US. Only U.S. citizens or permanent residents (Green Card holders) eligible due to U.S. export control laws.

Salary: $70,670 - $116,640

Company

hirify.global Foundry provides state-of-the-art semiconductor manufacturing, advanced packaging technology leadership for the AI era, and global scale supply chain.

What you will do

• Conduct physical and technical failure analysis to identify defects causing yield loss and determine root causes.
• Prepare samples and operate lab tools including SEM, EDX, X-ray, ion mill, mechanical polisher, and FIB.
• Document and communicate findings via technical reports and presentations to engineers, operators, and management.
• Provide recommendations for process, material, or equipment improvements.
• Act as tool owner, managing daily operations, maintenance, repairs, and supplies.
• Support backend shift operations, characterize yield excursions, and train peers and operators.

Requirements

• US citizen or permanent resident (Green Card) required due to export controls.
• High School diploma + 10+ years relevant experience, or AA/AS + 6+ years, or Bachelor's + 4+ years.
• Hands-on experience in failure analysis and defect characterization for semiconductor packaging or substrate manufacturing (preferred).
• Experience operating characterization tools such as SEM, EDX, X-ray, mechanical polisher, ion mill.
• Ability to work independently on backend or off-shifts.
• Compliance with safety, quality, and Stop-the-Job requirements.

Nice to have

• Experience in high-volume manufacturing or laboratory environment.
• Strong data analysis, technical reporting, and root cause determination skills.
• Working knowledge of package assembly processes and yield loss mechanisms.
• Tool ownership experience including maintenance and troubleshooting.
• Proficiency in advanced techniques like cross-sectioning, delayering, SEM/X-ray analysis.
• Ability to provide technical training and collaborate with cross-functional teams.

Culture & Benefits

• Competitive pay, stock bonuses, health, retirement, and vacation benefits.
• Focus on continuous improvement, manufacturing excellence, and Responsible Business Alliance compliance.
• Part of worldwide factory network improving lives through compute devices.
• Ethical hiring practices with no recruitment fees.