R&D Engineer Adv Tech Dev (PKE) / Sr. Staff (Semiconductors)

TL;DR

R&D Engineer Adv Tech Dev (PKE) / Sr. Staff (Semiconductors): Work with marketing, IC design, and engineering teams to select and design optimum package solutions for advanced silicon nodes (5nm, 3nm, 2nm+) with an accent on cost, performance, manufacturability, and reliability. Focus on researching new materials, managing packaging from concept to high-volume production, and troubleshooting advanced technology issues.

Location: Singapore - Yishun (Full time onsite)

Company

Global technology leader that designs, develops, and supplies a broad range of semiconductor and infrastructure software solutions.

What you will do

• Work with business unit marketing and IC design teams to select optimum package solutions balancing cost, performance, manufacturability, and reliability for new advanced silicon products.
• Collaborate with IC design, system design, SI/PI, and thermal teams to design custom packages meeting stringent CPI, SI/PI, and thermal requirements.
• Research, develop, and productize new materials like TIM, build-up-film, and underfill for advanced node silicon POR.
• Manage IC packaging activities from concept through development, qualification, and high-volume production.
• Define assembly BOM, processes, troubleshoot packaging issues, and create design documentation.
• Interface with suppliers, QA, customers, and operations groups for new product bring-up, qualification, production ramp, and issue resolution.

Requirements

• BS/MS/PhD in STEM/Material Science/Electrical/Mechanical Engineering; BS +8 years, MS +6 years, or PhD +3 years experience.
• Deep understanding of signal integrity, power integrity (impedance, s-parameters, power plane optimization).
• Strong expertise in Cadence APD for custom substrate design and hands-on advanced assembly processes (flipchip, MCM, 2.5D for 5nm+ nodes).
• Good knowledge of CPI-related materials, wafer BEOL, advanced substrate manufacturing (SAP/mSAP, PSPI w/ Cu RDL), and failure analysis on advanced nodes.
• Conceptual knowledge of package cost structure, GD&T, mechanical drawings, manufacturing/quality fundamentals (DOE, process capability).
• Strong project management, communication, leadership skills; ability to grow across multiple disciplines.

Nice to have

• Track record of innovation via journal publications or patents.
• Familiarity with advanced technologies like 2.5D, 3DIC, glass substrates.