Package Design Engineer (AI)

TL;DR

Package Design Engineer (AI): Designing and optimizing Organic and Advanced 2.5D/3D Chiplet packaging for high-performance AI platforms with an accent on SIPI-aware methodologies and AI automation. Focus on owning placement and routing of packages, optimizing stack-ups, and driving supplier engagement for emerging package technologies.

Location: Hybrid; based out of Toronto, ON (Canada) or Taipei City (Taiwan)

Salary: $100k - $500k

Company

hirify.global is leading the industry in cutting-edge AI technology, developing high-performance RISC-V CPUs and a comprehensive AI platform.

What you will do

• Own placement and routing of packages, including organic substrates and 2.5D interposers.
• Optimize routing, stack-ups, and design methodologies for emerging package technologies.
• Support layout verification, design rule checking (DRC), and overall package sign-off activities.
• Drive supplier engagement to develop new capabilities and continuous process improvements.
• Create and maintain engineering documentation, design rules, and BOM definitions.

Requirements

• BS/MS in Mechanical or Electrical Engineering.
• 5+ years of experience in layout and routing of 2.5D packages (CoWoS-S, -L, -R).
• Previous ownership of FCBGA package verification and tapeout (DRC/LVS, sign-off processes).
• Proficiency with automation and scripting using Python, TCL, SKILL, or similar.
• Must be eligible to access U.S. export-controlled technology (subject to EAR regulations).

Nice to have

• Experience with SIPI-aware methodologies.
• Knowledge of AI-based approaches for design iteration.

Culture & Benefits

• Highly competitive compensation package and benefits.
• Collaborative work environment driven by curiosity and solving hard problems.
• Equal opportunity employer.