Technical Fellow, Advanced Packaging Integration (Semiconductor)

TL;DR

Technical Fellow, Advanced Packaging Integration (Semiconductor): Leading technical strategy for advanced packaging and high-performance computing analysis with an accent on 2.5D/3D integration, chiplet architectures, and system-level performance. Focus on defining technology roadmaps, driving AI-enabled analytical workflows, and representing the company as a global subject matter expert.

Location: On-site at our Ottawa office. Travel required up to 25%.

Salary: $175,000 - $195,000 CAD

Company

hirify.global is the world's most trusted source of actionable intelligence for the semiconductor industry, providing deep reverse engineering and market analysis.

What you will do

• Serve as the primary subject matter expert for advanced packaging, HPC processors, and networking ASICs.
• Define and maintain technology roadmaps for advanced packaging and high-performance computing.
• Drive the evolution of system-level analysis, including thermal benchmarking and power delivery characterization.
• Implement AI-enabled tools to accelerate analysis speed, accuracy, and scalability.
• Represent the company globally at conferences and lead technical discussions with hyperscalers and foundries.
• Mentor analysts and foster cross-domain collaboration across packaging, logic, and system teams.

Requirements

• 10+ years of relevant industry experience in semiconductor packaging, interconnect, or processor design.
• Master’s or PhD in Nanotechnology, Electrical Engineering, Materials Science, or Applied Physics.
• Deep expertise in 2.5D/3D integration, hybrid bonding, chiplet architectures, or system-level analysis.
• Proven ability to apply AI and automation tools to technical workflows.
• Must be able to work on-site in Ottawa, Canada.
• Must provide citizenship/residency information for U.S. Export Control compliance.

Culture & Benefits

• Comprehensive benefits package including health, dental, vision, and wellness programs.
• RRSP/401K matching and annual fitness reimbursement.
• Flexible vacation policy and trusted device reimbursement.
• Inclusive environment prioritizing diversity and accessibility.
• High-growth, performance-driven culture with professional development opportunities.