Назад
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3 месяца назад

Head of Datacenter & Compute Business Unit (AI)

264 988 - 328 772$
Формат работы
onsite
Тип работы
fulltime
Грейд
head
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

Head of Datacenter & Compute Business Unit (AI): Leading hirify.global’ Datacenter & Compute Business Unit, owning full P&L responsibility and end-to-end strategy across one of the company’s highest-growth markets with an accent on market leadership, product definition, and engineering execution. Focus on building a scalable business in AI infrastructure, hyperscale datacenters, and high-performance compute platforms.

Location: Our salary ranges are determined by role, level, qualifications and work location. The range displayed on the job posting reflects the minimum and maximum target for new hire salaries for this position in California.

Salary: $264,988 to $328,772

Company

hirify.global is committed to building teams that drive innovation.

What you will do

  • Own full BU P&L including revenue growth, gross margin, and design-win pipeline.
  • Define and lead the Datacenter & Compute segment strategy.
  • Lead the BU’s dedicated IC design and system engineering teams.
  • Lead the NPD / System Applications team responsible for defining next-generation power solutions.
  • Own executive-level relationships with hyperscalers, server OEMs/ODMs, and infrastructure partners.
  • Lead cross-functional execution across engineering, operations, sales, marketing, and quality.

Requirements

  • 15+ years of experience in power semiconductors, power electronics, or datacenter infrastructure.
  • Proven ownership of P&L or equivalent business responsibility, including revenue growth, margin management, and design-win accountability.
  • Deep expertise in server and datacenter power architectures, AI / hyperscale infrastructure trends, and high-density and high-efficiency power conversion.
  • Strong experience with hyperscalers, server OEMs/ODMs, or cloud infrastructure providers.
  • Background in GaN, SiC, digital power, or advanced packaging technologies.
  • Demonstrated ability to operate in a global environment and lead distributed teams.

Culture & Benefits

  • Comprehensive total rewards package that includes equity, medical benefits, ESPP, 401K, tuition reimbursement and time off programs.

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