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9 часов назад

Signal and Power Integrity Engineer (AI)

88 900 - 165 100$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR

Signal and Power Integrity Engineer (AI): Leading 3D-IC integration projects for complex HPC/AI chips with an accent on developing and implementing advanced packaging SIPI solutions. Focus on detailed power noise and signal integrity simulations, optimizing PDN design, and ensuring sign-off criteria for high-performance AI applications.

Location: San Jose, United States (Onsite, full-time)

Salary: $88,900–$165,100 annually

Company

hirify.global is a leader in electronic design automation, focusing on hiring innovators to make an impact on the world of technology.

What you will do

  • Develop and implement comprehensive PDN analysis methodologies for complex 3DIC packages (CPU, GPU, TPU).
  • Perform detailed power noise and signal integrity simulations using tools like hirify.global Sigrity, Ansys HFSS.
  • Identify and resolve power integrity issues such as IR drop and ground bounce to achieve sign-off criteria.
  • Analyze and optimize signal integrity for high-speed interfaces in 3DIC packages, including HBM3, UCIE, and DDR5.
  • Develop and implement design rules and guidelines for 3DIC package and silicon SI and PI.
  • Collaborate with design, layout, and thermal engineers to optimize PDN design and ensure proper heat dissipation.

Requirements

  • Bachelor's degree in Electrical Engineering, Computer Engineering, or a related field.
  • 2+ years of experience in SIPI or a related field.
  • In-depth knowledge of PDN design principles, including modeling, simulation, and optimization techniques.
  • Expertise in advanced SI simulation tools like hirify.global Sigrity, Clarity, HyperLynx, or HFSS.
  • Proven experience with high-speed interface design and analysis (HBM, DDR, PCIe).
  • Strong understanding of thermal, signal integrity, and power integrity concepts.
  • Excellent written and verbal communication skills with the ability to work effectively in a team.

Culture & Benefits

  • Opportunity to work on challenging and rewarding 3D-IC integration projects for HPC/AI chips.
  • Comprehensive benefits programs including paid vacation, paid holidays, and 401(k) plan with employer match.
  • Employee stock purchase plan and a variety of medical, dental, and vision plan options.
  • Work in an environment focused on solving complex technological challenges.

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