PMTS Silicon Photonics Packaging Integration

Location: USA - Vermont - Essex Junction

Expected salary: $131,900.00–$241,500.00 per year

Company

hirify.global is a semiconductor foundry providing design, development, and fabrication services, with an Advanced Packaging and Photonics Center focused on optical interconnects and heterogeneous integration for AI, HPC, and data center applications.

What you will do

• Define, design, and qualify optical packaging architectures for silicon photonics modules, including fiber attach, photonic die placement, and thermal/mechanical integration.
• Develop scalable fiber-to-chip coupling strategies for high-density optical I/O, including V-groove, passive alignment, and lens integration.
• Drive heterogeneous integration of photonic and electronic components using 2.5D/3D/3.5D packaging technologies.
• Perform thermal, mechanical, and optical multiphysics simulations to optimize package performance and reliability.
• Lead root cause analysis and corrective actions for yield and reliability issues using FMEA, DOE, and failure-analysis tools.
• Collaborate with OSATs and manufacturing teams on production readiness, process transfer, cost modeling, and package cost reduction.

Requirements

• Master’s degree or higher in Packaging, Materials Science, Mechanical Engineering, or a related field.
• 15+ years of experience in semiconductor packaging, focused on photonic or advanced packaging.
• Hands-on experience with fiber attach processes, photonic alignment, and optical coupling techniques.
• Familiarity with die attach, flip-chip, underfill, molding, and micro-optics integration.
• Understanding of reliability standards and qualification methodologies for optical modules.
• Experience bringing packaged products from development into production.
• Excellent analytical, problem-solving, and communication skills.
• Strong written and spoken English communication skills.

Nice to have

• Experience with automated optical/electro-optical test setups and motion control systems, including Python-based systems.
• Knowledge of co-packaged optics, pluggable modules, and silicon photonics ecosystems.
• Experience with thermal/mechanical modeling and optical simulation tools such as Lumerical and COMSOL.
• Familiarity with GF’s Fotonix™ platform, 300mm monolithic silicon photonics integration, and advanced packaging flows.
• Experience working with OSATs and managing external development partners.
• Ability to lead cross-functional teams and influence technical direction.

Culture & Benefits

• Full-time role within a global semiconductor manufacturing organization.
• Work must be performed at the Essex Junction, Vermont location.
• Support Environmental, Health, Safety & Security requirements and programs.
• Employment is subject to applicable pre-employment conditions and laws.
• Equal opportunity workplace with reasonable accommodation available during the employment process.