Thermo-Mechanical Engineer (Semiconductor Packaging)

Location: Fully onsite in Boston, Massachusetts, United States

Salary: $150,000–$220,000 base salary plus founding-team equity

Company

Early-stage semiconductor startup developing next-generation 3D heterogeneous integration technology that combines silicon, III-V materials, and novel interposers into advanced semiconductor systems for defense, aerospace, power electronics, and future AI compute infrastructure.

What you will do

• Lead thermal and mechanical design for a new semiconductor integration platform as a founding engineer.
• Develop simulation and reliability methodologies for advanced 3D heterogeneous packaging.
• Perform thermal and structural finite element analysis using ANSYS, COMSOL, Icepak, or similar tools.
• Analyze thermal management, mechanical stress, warpage, and package-level reliability.
• Conduct thermal measurements, validation, and evaluation of advanced cooling technologies.

Requirements

• PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience.
• Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak, or similar tools.
• Experience with advanced semiconductor packaging, heterogeneous integration, or 3D stacked die.
• Strong understanding of thermal management, mechanical stress, warpage, and reliability.
• Hands-on experience with thermal measurement and validation or advanced cooling technologies.

Nice to have

• Experience with package-level simulations, microbump fatigue, or die-attach reliability.

Culture & Benefits

• Founding-team role with ownership of complex engineering challenges from first principles.
• Fully onsite work in Boston, MA.
• Founding-team equity in addition to the base salary.