Co-Packaged Optics Packaging Process Development Engineer (AI)

Location: Santa Clara, CA, United States of America

Expected base pay: $141,150–$211,400 per annum

Company

hirify.global develops semiconductor solutions for enterprise, cloud, AI, and carrier data infrastructure.

What you will do

• Lead semiconductor packaging process and technology development with foundries, OSATs, consumable suppliers, and cross-functional packaging teams.
• Develop 2.5D/3D chip-on-wafer and advanced interconnect processes from concept and prototypes through high-volume manufacturing.
• Manage package qualification with a focus on thermo-mechanical reliability, physics of failure, testing, failure analysis, and cost constraints.
• Identify and mitigate technology and process risks while driving factory readiness through NPI.
• Manage internal and external resources, milestones, technical status, and issue resolution.
• Drive advanced package solution specifications, ideation, and vendor innovation for Celestial AI productization.

Requirements

• 7+ years of experience in semiconductor packaging, process, and technology development.
• Expert understanding of advanced foundry process nodes and their interaction with packaging, assembly, substrates, and package technologies.
• Expertise in advanced packaging technologies and high-density, high-performance TSV interconnects across 2.5D/3D package form factors.
• Proven experience taking products from technology development and package design through qualification, NPI, and high-volume manufacturing.
• Working knowledge of package architecture, design rules, BOM, enabling materials and processes, mechanical engineering, design for manufacturing, reliability, and cost.
• Familiarity with component- and system-level reliability, testing, and failure analysis.
• Project management experience, including communicating technical and program status and resolving issues at executive level.
• Excellent problem-solving, scientific, analytical, engineering judgment, communication, and attention-to-detail skills; ability to work independently and complete projects with minimal supervision.
• M.S. or Ph.D. in Chemical Engineering, Materials Science, Mechanical Engineering, Chemistry, or Physics.

Nice to have

• Experience with photonics packaging.

Culture & Benefits

• Full-time position with bonus and equity plan eligibility, including a new-hire equity grant and annual equity refreshers.
• Benefits support financial well-being, family support, mental and physical health, and recognition.
• Benefits include an employee stock purchase plan with a two-year lookback, family support programs, mental health resources, and recognition awards.
• Access to export-controlled technology may require eligibility under U.S. export control laws; applicants other than U.S. citizens, lawful permanent residents, or protected individuals may undergo an export license review.
• AI tools, transcription apps, automated answer generators, and note-taking bots are prohibited during interviews; unauthorized use results in disqualification.

Hiring process

• Interview participation must reflect the candidate’s individual experience, thought process, and communication skills without unauthorized AI assistance.
• Reasonable accommodation requests during selection can be directed to the hirify.global HR Helpdesk.