Advanced Packaging Module Engineer (Semiconductor)

Location: On-site in Albuquerque, New Mexico, United States; regular on-site presence is required.

Annual salary: $76,390–$146,440 USD.

Company

hirify.global develops and manufactures semiconductor technologies and advanced packaging solutions.

What you will do

• Support high-volume manufacturing and technology development for wafer-level assembly, die preparation, metrology, Foveros, Embedded Bridge, and hirify.global Foundry Services technologies.
• Transfer processes between partner factories, maintain Copy Exactly standards, and drive process and equipment improvements.
• Develop technology roadmaps and deliver process requirements, business objectives, and key milestones.
• Install, qualify, and ramp equipment and manufacturing processes for new product introductions and production start-ups.
• Resolve complex technical challenges, prevent recurrence, and sustain development and pilot production lines.
• Collaborate with engineers, technicians, integration teams, shift leadership, and management; lead task forces and cross-functional initiatives.

Requirements

• Bachelor’s degree in Materials Science and Engineering, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related technical field.
• Completed academic coursework, laboratory work, or technical projects in semiconductor technologies, electronics, or mechanical engineering.
• Strong safety commitment, analytical and problem-solving skills, organizational ability, initiative, accountability, and clear technical communication.
• Ability to work effectively in high-performing teams and demonstrate leadership, collaboration, prioritization, and continuous-improvement capabilities.
• Experience applying Lean principles and methodologies to manufacturing or operational improvement.

Nice to have

• 2+ years of relevant experience with a bachelor’s degree, or no prior experience with a master’s degree.
• Familiarity with semiconductor manufacturing process flows, especially advanced packaging technologies.
• Hands-on experience with semiconductor manufacturing equipment, including tool matching, calibration, and performance optimization.
• Experience with tool installation, qualification, and production-readiness activities.
• Working knowledge of Design of Experiments (DOE) for tool matching, process qualification, and continuous improvement.
• Data-driven problem solving and root cause analysis using Model-Based Problem Solving (MBPS), DOE, Statistical Process Control (SPC), and Failure Mode and Effects Analysis (FMEA).

Culture & Benefits

• Full-time employment with Shift 1 scheduling.
• Benefits include health coverage, retirement programs, vacation, competitive pay, and stock bonuses.
• Safety, ergonomic improvement, operational excellence, and continuous improvement are emphasized.
• The role supports both high-volume manufacturing and technology development activities.