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6 дней назад

Senior Advanced Semiconductor Packaging Engineer (Quantum Computing)

147 000 - 197 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Senior Advanced Semiconductor Packaging Engineer (Quantum Computing): Developing innovative and reliable packaging schemes for highly scaled ion traps in quantum computers with an accent on mechanical, thermal, electrical, optical, and detection interfaces. Focus on large-format ion trap chips, high-density I/O, heterogeneous integration, vendor process validation, and cross-functional system compatibility.

Location: Onsite in Brooklyn Park, Minnesota, or at a supplier site in Malta, New York; U.S. Person status required.

Salary: USD 147,000–197,000 per year.

Company

hirify.global develops a full-stack quantum computing platform for real-world applications across pharmaceuticals, materials science, financial services, government, industrial sectors, and research institutions.

What you will do

  • Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces for next-generation ion traps.
  • Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density.
  • Work with vendors to implement and validate packaging processes.
  • Support all stages of ion trap development and ensure compatibility with packaging requirements.
  • Interface with ASIC, ion trap, optical design, fabrication, and broader company teams to meet system requirements.
  • Engage third parties to develop partnerships, supplier relationships, and co-development opportunities.

Requirements

  • Bachelor’s degree or higher.
  • At least 5 years of experience in an engineering or R&D environment, including at least 3 years in advanced semiconductor packaging development.
  • Must be a U.S. Person due to contractual requirements: U.S. citizen, lawful permanent resident or green card holder, or person granted asylum or refugee status.
  • Experience with advanced packaging concepts and cross-functional technical collaboration.
  • Applicants for this safety-sensitive position must complete a pre-employment drug test.

Nice to have

  • PhD in Physics or Engineering.
  • Seven years of experience with advanced large-area multi-chip semiconductor packaging technologies.
  • Five years of experience with large heterogeneous integration and 2.5D–3D packaging techniques.
  • Five years of experience with high-density I/O technologies.
  • Experience with photonic packaging and fiber-to-chip coupling.
  • Proven innovation and IP development record.
  • Experience in a cross-functional team environment.

Culture & Benefits

  • Fast-paced, multifunctional, team-based technical environment.
  • Full-time hirify.global employment with competitive compensation and work on quantum computing technology.
  • Employer-subsidized medical, dental, and vision insurance.
  • 401(k) plan with company match, student loan repayment benefit, equity opportunities, paid time off, sick leave, and 12 paid holidays.
  • Paid parental leave, employee discount programs, and flexible work arrangements supporting work-life balance.

Hiring process

  • Applications are accepted on an ongoing basis with no application deadline.
  • Reasonable accommodations are available at every stage of the application and interview process.

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