quantum computingsemiconductor packagingheterogeneous integration3d packaging2.5d packagingphotonic packagingfiber to chip couplingion trapshigh density i o
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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$147к-197к/год
$150к$160кмедиана$190к
По похожим ролям (50) ~ $160к/год
На СНГ рынке: $3.1к/мес ($2.5к - $3.5к)
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Чётко очерченная инженерная роль в ведущей компании в сфере квантовых вычислений даёт возможность работать над специализированным оборудованием, но требует присутствия на площадке и статуса U.S. Person.
Ограничение по статусу
Квантовое оборудование
Чёткая зона ответственности
Поддержка баланса
Мэтч & Сопровод
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Senior Advanced Semiconductor Packaging Engineer (Quantum Computing): Developing innovative and reliable packaging schemes for highly scaled ion traps in quantum computers with an accent on mechanical, thermal, electrical, optical, and detection interfaces. Focus on large-format ion trap chips, high-density I/O, heterogeneous integration, vendor process validation, and cross-functional system compatibility.
Location: Onsite in Brooklyn Park, Minnesota, or at a supplier site in Malta, New York; U.S. Person status required.
Salary: USD 147,000–197,000 per year.
Company
hirify.global develops a full-stack quantum computing platform for real-world applications across pharmaceuticals, materials science, financial services, government, industrial sectors, and research institutions.
What you will do
Develop and implement advanced packaging concepts for mechanical, thermal, electrical, optical, and detection interfaces for next-generation ion traps.
Develop packaging strategies and processes for large-format ion trap chips with high I/O signal count and density.
Work with vendors to implement and validate packaging processes.
Support all stages of ion trap development and ensure compatibility with packaging requirements.
Interface with ASIC, ion trap, optical design, fabrication, and broader company teams to meet system requirements.
Engage third parties to develop partnerships, supplier relationships, and co-development opportunities.
Requirements
Bachelor’s degree or higher.
At least 5 years of experience in an engineering or R&D environment, including at least 3 years in advanced semiconductor packaging development.
Must be a U.S. Person due to contractual requirements: U.S. citizen, lawful permanent resident or green card holder, or person granted asylum or refugee status.
Experience with advanced packaging concepts and cross-functional technical collaboration.
Applicants for this safety-sensitive position must complete a pre-employment drug test.
Nice to have
PhD in Physics or Engineering.
Seven years of experience with advanced large-area multi-chip semiconductor packaging technologies.
Five years of experience with large heterogeneous integration and 2.5D–3D packaging techniques.
Five years of experience with high-density I/O technologies.
Experience with photonic packaging and fiber-to-chip coupling.
Proven innovation and IP development record.
Experience in a cross-functional team environment.
Full-time hirify.global employment with competitive compensation and work on quantum computing technology.
Employer-subsidized medical, dental, and vision insurance.
401(k) plan with company match, student loan repayment benefit, equity opportunities, paid time off, sick leave, and 12 paid holidays.
Paid parental leave, employee discount programs, and flexible work arrangements supporting work-life balance.
Hiring process
Applications are accepted on an ongoing basis with no application deadline.
Reasonable accommodations are available at every stage of the application and interview process.
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