Director Product Management - HW Platforms (AI Networking)

Location: In-person role based in Santa Clara, California, United States

Expected base pay: $173,370–$259,700 per annum

Company

hirify.global develops semiconductor solutions and hardware platforms for enterprise, cloud, AI, carrier, networking, and data infrastructure applications.

What you will do

• Own product strategy, roadmaps, and business execution for platform-level solutions, including switch-based systems, CPO/CPC integrated platforms, and reference architectures for hyperscale AI data centers.
• Drive Market Requirements Documents and Product Requirements Documents through the product lifecycle from proposal approval through production.
• Lead cross-functional alignment across engineering, program management, sales, and marketing to deliver programs on schedule, within budget, and against customer commitments.
• Engage hyperscale customers, capture infrastructure requirements, and translate them into product strategies.
• Present business cases, competitive analysis, financials, and program status to executive leadership, including CEO-level audiences.
• Define product financials and collaborate with technical teams on go-to-market collateral, reference architectures, and customer-facing content.

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related technical field; a master’s degree is preferred.
• 10+ years of experience in product management, product marketing, or a related technical role in the semiconductor or networking industry.
• Deep understanding of data center networking architectures, Ethernet switching, scale-out and scale-up fabrics, and AI/HPC infrastructure.
• Experience driving products through the full lifecycle from market requirements through production release.
• Strong business acumen and experience building and presenting financial models, including IRR, revenue forecasts, and competitive pricing.
• Excellent communication and executive presentation skills, including comfort presenting to C-level audiences internally and externally.
• Ability to lead cross-functional teams and influence without direct authority across engineering, sales, and marketing.
• Experience working directly with hyperscale or cloud customers on silicon or systems programs.
• Applicants must be eligible to access export-controlled technology and software under applicable U.S. export control laws; some applicants may be subject to an export license review.

Nice to have

• Experience with co-packaged optics, co-packaged copper, or advanced packaging technologies.
• Platform- or systems-level product management experience at a semiconductor company.
• Familiarity with open networking software stacks such as SONiC, SAI, and OpenConfig in AI data center deployments.

Culture & Benefits

• Eligible for bonus and equity plans, including a new-hire equity grant and annual equity refreshers.
• Benefits support financial well-being, family support, mental and physical health, and recognition.
• Benefits include an employee stock purchase plan with a two-year lookback, family support programs, mental health resources, and recognition and service awards.
• AI tools, transcription apps, real-time answer generators, and automated note-taking bots are prohibited during interviews; unauthorized use results in disqualification.

Hiring process

• Interviews assess individual experience, thought process, and communication skills in real time.
• Reasonable accommodation requests during selection may be directed to hirify.global HR Helpdesk.