Module Equipment Development Engineer (Semiconductor)
Контакты
115 110 - 219 550$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
pythonmaterials sciencestatistical process controlprocess integrationdesign of experimentssemiconductor processingequipment developmentthin film deposition
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
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$115к-220к/год
$130к$150кмедиана$170к
По похожим ролям (50) ~ $150к/год
На СНГ рынке: $1.6к/мес ($1.4к - $2.1к)
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Текст:
Hirify AI/Оригинал
TL;DR
Module Equipment Development Engineer (Semiconductor): Developing and optimizing advanced semiconductor manufacturing equipment and processes for dielectric thin films, with an accent on equipment module development, process characterization, and technology transfer to high-volume manufacturing. Focus on designing experiments, applying SPC and DOE, evaluating supplier technologies, and improving process yield and manufacturability.
Location: Hybrid role based at the hirify.global site in Hillsboro, Oregon, United States, with time split between on-site and off-site work.
Annual salary: $115,110–$219,550 USD.
Company
hirify.global Foundry Technology Development advances semiconductor process engineering and manufacturing solutions for leading-edge devices.
What you will do
Develop equipment capable of meeting new dielectric thin-film process requirements.
Develop robust equipment modules suitable for transfer to high-volume manufacturing.
Work with equipment and material suppliers to evaluate, qualify, and implement novel technologies.
Support technology transfer through training, audits, and process consistency across manufacturing sites.
Design, execute, and analyze experiments covering material selection, equipment metrology, and parameter tuning.
Perform feasibility studies and pathfinding for innovative device architectures and future technology roadmaps.
Use SPC and DOE to guide process improvements and increase yield.
Partner with cross-functional teams on process integration and manufacturability.
Requirements
Bachelor’s degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related STEM field, plus 4+ years of industry experience in semiconductor processing; or a relevant master’s degree plus 3+ years of domain-specific experience; or a relevant PhD plus 6+ months of semiconductor processing experience.
Experience in semiconductor processing, including one or more of lithography, etching, thin-film deposition, or planarization.
Experience with process characterization and statistical analysis tools such as JMP, MATLAB, or Python.
Familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry.
Nice to have
Hands-on experience with equipment troubleshooting, maintenance, or development in collaboration with suppliers.
Experience at a semiconductor manufacturing tool supplier.
Knowledge of vacuum processes, ALD, or CVD.
Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment.
Experience working across interdisciplinary teams to achieve shared goals.
Culture & Benefits
Full-time experienced-hire position on Shift 1.
Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
Compensation package includes competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
Work within a global, cross-functional semiconductor technology development organization.
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