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1 день назад

Module Equipment Development Engineer (Semiconductor)

115 110 - 219 550$
Формат работы
hybrid
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Module Equipment Development Engineer (Semiconductor): Developing and optimizing advanced semiconductor manufacturing equipment and processes for dielectric thin films, with an accent on equipment module development, process characterization, and technology transfer to high-volume manufacturing. Focus on designing experiments, applying SPC and DOE, evaluating supplier technologies, and improving process yield and manufacturability.

Location: Hybrid role based at the hirify.global site in Hillsboro, Oregon, United States, with time split between on-site and off-site work.

Annual salary: $115,110–$219,550 USD.

Company

hirify.global Foundry Technology Development advances semiconductor process engineering and manufacturing solutions for leading-edge devices.

What you will do

  • Develop equipment capable of meeting new dielectric thin-film process requirements.
  • Develop robust equipment modules suitable for transfer to high-volume manufacturing.
  • Work with equipment and material suppliers to evaluate, qualify, and implement novel technologies.
  • Support technology transfer through training, audits, and process consistency across manufacturing sites.
  • Design, execute, and analyze experiments covering material selection, equipment metrology, and parameter tuning.
  • Perform feasibility studies and pathfinding for innovative device architectures and future technology roadmaps.
  • Use SPC and DOE to guide process improvements and increase yield.
  • Partner with cross-functional teams on process integration and manufacturability.

Requirements

  • Bachelor’s degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related STEM field, plus 4+ years of industry experience in semiconductor processing; or a relevant master’s degree plus 3+ years of domain-specific experience; or a relevant PhD plus 6+ months of semiconductor processing experience.
  • Experience in semiconductor processing, including one or more of lithography, etching, thin-film deposition, or planarization.
  • Experience with process characterization and statistical analysis tools such as JMP, MATLAB, or Python.
  • Familiarity with materials characterization techniques such as SEM, TEM, XPS, or ellipsometry.

Nice to have

  • Hands-on experience with equipment troubleshooting, maintenance, or development in collaboration with suppliers.
  • Experience at a semiconductor manufacturing tool supplier.
  • Knowledge of vacuum processes, ALD, or CVD.
  • Strong problem-solving skills and the ability to manage multiple tasks in a fast-paced environment.
  • Experience working across interdisciplinary teams to achieve shared goals.

Culture & Benefits

  • Full-time experienced-hire position on Shift 1.
  • Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
  • Compensation package includes competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
  • Work within a global, cross-functional semiconductor technology development organization.

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