New Product Manufacturing Engineer II (Semiconductor)
Контакты
78 500 - 108 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
sapnxcadroot cause analysismanufacturing engineeringbill of materialsteamcenterengineering change orders
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
Нижеразвернуть
$79к-108к/год
$100к$130кмедиана$140к
По похожим ролям (50) ~ $130к/год
На СНГ рынке: $1.4к/мес ($1.2к - $2.1к)
74
Хорошая вакансия
развернуть
Чётко очерченная инженерная роль в ведущей компании по оборудованию для производства полупроводников даёт опыт запуска продуктов и работы с разными командами, хотя обязательная работа на месте снижает гибкость.
Ниже рынка
Полупроводниковая отрасль
Понятные задачи
Поддержка развития
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
New Product Manufacturing Engineer II (Semiconductor): Commercializing newly designed semiconductor equipment and product features from initial design through volume manufacturing with an accent on manufacturability, engineering change orders, product structures, and supplier coordination. Focus on creating and maintaining UG/NX models and BOMs, resolving assembly and test issues through root cause analysis, and transitioning new products into volume operations.
Location: Kalispell, MT, United States of America; onsite role with 10% travel and relocation eligibility.
Salary: $78,500.00–$108,000.00 per year
Company
hirify.global develops materials science and engineering solutions and equipment used in semiconductor chips and advanced displays.
What you will do
Commercialize newly designed products and features from initial design through volume manufacturing.
Review and modify engineering designs for manufacturability at supplier and hirify.global manufacturing operations.
Lead design reviews, coordinate new product and product improvement releases, and interface with design engineering, operations, product management, materials, manufacturing teams, and suppliers.
Create, release, approve, and implement engineering change orders; own SMBOM releases, BOM requests, OMS documentation, and product options and variants.
Create and maintain new product master layouts in UG/NX and use Teamcenter throughout the product development process.
Support new product builds, identify root causes of assembly and test issues, implement corrective actions, and transition products from NPI to volume manufacturing.
Requirements
BS degree in an engineering discipline.
At least 2 years of manufacturing or engineering experience, or equivalent; 3–5 years of previous manufacturing or engineering experience preferred.
Demonstrated knowledge of manufacturing engineering principles, practices, and theories.
Knowledge of product structures, bills of materials, product safety requirements, material handling, root cause analysis, engineering change orders, DFx, value engineering, specification waivers, and producibility/manufacturability analysis.
Working-level knowledge of CAD tools UG/NX and Teamcenter, SAP BOM, and engineering change orders.
Working-level skills in product technology, change management, problem solving, communication, customer orientation, personal effectiveness, teamwork, and quality.
Knowledge of MS Word, Excel, PowerPoint, flowcharting, and FMECA.
Knowledge of supplier manufacturing processes and the ability to engage suppliers to resolve issues.
Culture & Benefits
Full-time regular employee position with a supportive culture focused on learning, development, and career growth.
Comprehensive benefits and programs supporting employee health and wellbeing.
Potential eligibility for bonus and stock award programs, as applicable.
Travel required for approximately 10% of working time.
Relocation eligible.
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