pythonmatlabmaterials sciencemetrologyopticselectromagneticsdevice physicsdesign of experimentssemiconductor packaging
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
развернуть
$142к-200к/год
$130к$140кмедиана$160к
По похожим ролям (50) ~ $140к/год
На СНГ рынке: $1.6к/мес ($1.4к - $2.1к)
88
Крутая вакансия
развернуть
В Company hidden предлагают чётко очерченную исследовательскую роль в передовой упаковке микросхем, с глубокой технической задачей и работой на стыке R&D-команд.
Передовые исследования
Понятный круг задач
Сильная R&D-среда
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Semiconductor Research Engineer (Semiconductor Packaging and Metrology): Designing, prototyping, and testing devices, interconnects, and packaging solutions for next-generation semiconductor technologies with an accent on device physics, optics, electromagnetics, materials science, and thermomechanical analysis. Focus on developing metrology prototypes, characterizing components and devices, modeling performance and reliability trade-offs, and executing experiments with cross-functional teams.
Location: On-site in Phoenix, Arizona, United States
Annual salary: $141,910–$200,340 USD
Company
hirify.global develops semiconductor technologies, including advanced assembly, packaging, metrology, and interconnect solutions.
What you will do
Research novel semiconductor devices and packaging technologies using device physics, optics, electromagnetics, and thermomechanical analysis.
Design and fabricate metrology prototypes for semiconductor assembly and interconnect solutions.
Develop testing methodologies for component and device characterization, including dimensional measurements, optical signal loss, and stressing.
Plan and execute experiments with cross-functional teams and benchmark results against industry standards.
Model design, performance, and reliability trade-offs to identify optimal solutions.
Collaborate with external vendors and researchers to support the research pipeline.
Requirements
Master’s degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience, or a PhD with 2+ years of experience.
Required experience in research involving optical test metrology, dimensional metrology, and packaging design methodologies.
Programming skills in Python or MATLAB for engineering applications.
Experience with experimental setups and data analysis techniques for laboratory testing.
Analytical, problem-solving, organizational, and communication skills.
Ability to lead and influence technical teams, present findings, and mentor team members.
Nice to have
Experience with advanced Co-Packaged Optics (CPO).
Experience with advanced packaging technologies such as EMIB and Foveros architectures.
Expertise in Design of Experiments, statistical analysis methods, and model-based problem-solving.
Familiarity with materials characterization techniques and cross-disciplinary collaboration.
Culture & Benefits
Full-time experienced-hire position with on-site work required.
Benefits include health coverage, retirement programs, vacation, competitive pay, and stock bonuses.
Work is performed in a research environment focused on innovation, collaboration, and semiconductor technology development.
Будьте осторожны
Если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого. Это мошенники. Обязательно жмите «Пожаловаться» или пишите в поддержку. Подробнее в гайде →