Назад
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3 дня назад

Semiconductor Research Engineer

141 910 - 200 340$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Semiconductor Research Engineer (Semiconductor Packaging and Metrology): Designing, prototyping, and testing devices, interconnects, and packaging solutions for next-generation semiconductor technologies with an accent on device physics, optics, electromagnetics, materials science, and thermomechanical analysis. Focus on developing metrology prototypes, characterizing components and devices, modeling performance and reliability trade-offs, and executing experiments with cross-functional teams.

Location: On-site in Phoenix, Arizona, United States

Annual salary: $141,910–$200,340 USD

Company

hirify.global develops semiconductor technologies, including advanced assembly, packaging, metrology, and interconnect solutions.

What you will do

  • Research novel semiconductor devices and packaging technologies using device physics, optics, electromagnetics, and thermomechanical analysis.
  • Design and fabricate metrology prototypes for semiconductor assembly and interconnect solutions.
  • Develop testing methodologies for component and device characterization, including dimensional measurements, optical signal loss, and stressing.
  • Plan and execute experiments with cross-functional teams and benchmark results against industry standards.
  • Model design, performance, and reliability trade-offs to identify optimal solutions.
  • Collaborate with external vendors and researchers to support the research pipeline.

Requirements

  • Master’s degree in Electrical Engineering, Physics, Materials Science, Mechanical Engineering, or a related field with 4+ years of experience, or a PhD with 2+ years of experience.
  • Required experience in research involving optical test metrology, dimensional metrology, and packaging design methodologies.
  • Programming skills in Python or MATLAB for engineering applications.
  • Experience with experimental setups and data analysis techniques for laboratory testing.
  • Analytical, problem-solving, organizational, and communication skills.
  • Ability to lead and influence technical teams, present findings, and mentor team members.

Nice to have

  • Experience with advanced Co-Packaged Optics (CPO).
  • Experience with advanced packaging technologies such as EMIB and Foveros architectures.
  • Expertise in Design of Experiments, statistical analysis methods, and model-based problem-solving.
  • Familiarity with materials characterization techniques and cross-disciplinary collaboration.

Culture & Benefits

  • Full-time experienced-hire position with on-site work required.
  • Benefits include health coverage, retirement programs, vacation, competitive pay, and stock bonuses.
  • Work is performed in a research environment focused on innovation, collaboration, and semiconductor technology development.

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