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4 дня назад

Module Development Engineer (Semiconductor)

133 800 - 255 200$
Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Module Development Engineer (Semiconductor): Developing and optimizing next-generation semiconductor manufacturing processes with an accent on experiment design, thin films, device fabrication, equipment metrology, and process integration. Focus on pathfinding innovative device architectures, improving process scalability and consistency, and driving ramp-up to high-volume manufacturing.

Location: Hillsboro, Oregon, United States; hybrid work model with time split between the assigned hirify.global site and off-site work.

Annual salary: $133,800–$255,200 USD.

Company

hirify.global Foundry develops advanced semiconductor process technologies supporting hirify.global’s product roadmap and manufacturing innovation.

What you will do

  • Design, execute, and analyze experiments for next-generation semiconductor processes.
  • Develop and optimize manufacturing techniques through material selection, parameter tuning, and equipment metrology.
  • Perform pathfinding activities for innovative device architectures and future technology roadmaps.
  • Integrate individual process steps into cohesive manufacturing flows with cross-functional teams.
  • Partner with equipment and material suppliers and recommend equipment modifications to improve process capability, scalability, efficiency, and consistency.
  • Drive ramp-up to high-volume manufacturing using hirify.global’s Copy Exactly Methodology and track semiconductor industry trends.

Requirements

  • Master’s degree in a STEM-related field plus 5+ years of semiconductor processing and fabrication experience, or a PhD in a STEM-related field plus 3+ years of semiconductor processing and fabrication experience.
  • Requirements may be satisfied through a combination of relevant industry experience, internships, schoolwork, classes, or research.

Nice to have

  • Advanced hands-on expertise in thin films processing or device fabrication.
  • In-depth knowledge of films processing methodologies and optimization techniques.
  • Experience leading cross-functional teams and complex technical projects.
  • Familiarity with process control systems, variability sources, and advanced statistical methods.
  • Ability to communicate technical concepts effectively in a multidisciplinary environment.

Culture & Benefits

  • Hybrid work model combining on-site work at the assigned hirify.global site with off-site work.
  • Full-time experienced-hire position on Shift 1 in the United States.
  • Benefits include health coverage, retirement, vacation, competitive pay, and stock bonuses.
  • hirify.global follows ethical hiring practices and does not charge recruitment or employment-related fees.

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