Process Engineer - Advanced Packaging R&D (Semiconductor)

Location: Santa Clara, CA, United States; onsite role with travel up to 10% of the time; relocation eligible.

Salary: $147,000–$202,500 per year.

Company

hirify.global develops materials science and engineering solutions, equipment, and services for semiconductor chips and advanced displays.

What you will do

• Design experiments, collect and analyze data, and compile reports for complex process engineering projects across multiple products.
• Characterize hardware and complex systems using defined techniques, new technologies, and analytical instrumentation.
• Generate product documentation, presentations, technical reports, and process engineering specifications.
• Plan and execute process engineering projects within safety guidelines and implement new technologies and products.
• Train engineers on film-property measurement, data interpretation, methodologies, troubleshooting, and issue resolution.
• Engage with customers, vendors, and suppliers to resolve complex engineering issues and lead functional teams or projects as needed.

Requirements

• Bachelor’s degree in a related field.
• 7–10 years of related experience.
• Conceptual and practical expertise in complex problem solving.

Culture & Benefits

• Supportive work culture focused on learning, development, and career growth.
• Opportunity to collaborate with R&D teams on state-of-the-art semiconductor and display research projects.
• Health and wellbeing programs and a comprehensive benefits package.
• Additional compensation may include bonus and stock awards, as applicable.
• Regular employment position with full-time work commitment.