Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Текст:
Hirify AI/Оригинал
TL;DR
PCB Layout Engineer (AI Hardware): Developing complex multilayer boards for high-performance computing systems with an accent on dense BGA placement, high-speed interconnects, and high-current power distribution. Focus on stack planning, signal and power integrity, manufacturability reviews, prototype bring-up, and CAD workflow automation.
Location: San Francisco County, California, United States
Salary: $150,000–$250,000 per year
Company
hirify.global is partnering with an AI hardware company developing high-performance computing systems.
What you will do
Lead PCB layout from layer-stack planning and impedance definition through component placement, routing, and production documentation.
Develop breakout and routing strategies for large, fine-pitch BGA devices and implement power distribution layouts for demanding current and thermal requirements.
Translate electrical and mechanical requirements into practical layout constraints while resolving design tradeoffs with engineering teams.
Coordinate manufacturability and assembly reviews with PCB suppliers and manufacturing partners.
Support prototype evaluation, troubleshooting, board bring-up, and subsequent revisions.
Improve layout productivity and design checks through scripting, automation, and new CAD capabilities.
Requirements
5+ years of PCB layout experience supporting complex computing, server, networking, or related hardware.
Strong experience with dense, multilayer boards carrying high-speed signals and substantial power loads.
Knowledge of controlled impedance, return-current paths, crosstalk mitigation, timing constraints, and via structures.
Proficiency with a professional PCB design platform such as Allegro, Xpedition, Altium, or a comparable tool.
Experience preparing and reviewing fabrication and assembly deliverables.
Ability to collaborate with signal integrity, power integrity, packaging, and systems engineers throughout the design cycle.
Nice to have
Experience with advanced semiconductor packaging, multi-die devices, or high-bandwidth memory.
Backplane or rigid-flex layout experience.
CAD scripting and workflow automation experience.
IPC design certification.
Direct coordination with PCB fabrication and assembly suppliers.
Culture & Benefits
Collaboration with hardware, packaging, signal integrity, power integrity, systems, and manufacturing engineering teams.
Work with external PCB fabrication and assembly partners throughout the design cycle.
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