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7 дней назад

PCB Layout Engineer (AI)

150 000 - 250 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
PCB Layout Engineer (AI Hardware): Developing complex multilayer boards for high-performance computing systems with an accent on dense BGA placement, high-speed interconnects, and high-current power distribution. Focus on stack planning, signal and power integrity, manufacturability reviews, prototype bring-up, and CAD workflow automation.

Location: San Francisco County, California, United States

Salary: $150,000–$250,000 per year

Company

hirify.global is partnering with an AI hardware company developing high-performance computing systems.

What you will do

  • Lead PCB layout from layer-stack planning and impedance definition through component placement, routing, and production documentation.
  • Develop breakout and routing strategies for large, fine-pitch BGA devices and implement power distribution layouts for demanding current and thermal requirements.
  • Translate electrical and mechanical requirements into practical layout constraints while resolving design tradeoffs with engineering teams.
  • Coordinate manufacturability and assembly reviews with PCB suppliers and manufacturing partners.
  • Support prototype evaluation, troubleshooting, board bring-up, and subsequent revisions.
  • Improve layout productivity and design checks through scripting, automation, and new CAD capabilities.

Requirements

  • 5+ years of PCB layout experience supporting complex computing, server, networking, or related hardware.
  • Strong experience with dense, multilayer boards carrying high-speed signals and substantial power loads.
  • Knowledge of controlled impedance, return-current paths, crosstalk mitigation, timing constraints, and via structures.
  • Proficiency with a professional PCB design platform such as Allegro, Xpedition, Altium, or a comparable tool.
  • Experience preparing and reviewing fabrication and assembly deliverables.
  • Ability to collaborate with signal integrity, power integrity, packaging, and systems engineers throughout the design cycle.

Nice to have

  • Experience with advanced semiconductor packaging, multi-die devices, or high-bandwidth memory.
  • Backplane or rigid-flex layout experience.
  • CAD scripting and workflow automation experience.
  • IPC design certification.
  • Direct coordination with PCB fabrication and assembly suppliers.

Culture & Benefits

  • Collaboration with hardware, packaging, signal integrity, power integrity, systems, and manufacturing engineering teams.
  • Work with external PCB fabrication and assembly partners throughout the design cycle.

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