Thin Films Module Development Engineer (Semiconductor)
Контакты
155 520 - 255 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
process optimizationprocess developmentmetrologydefect reductionstatistical process controldesign of experimentsthin filmssemiconductor manufacturingdry etch
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$156к-255к/год
$180к$190кмедиана$220к
По похожим ролям (50) ~ $190к/год
На СНГ рынке: $2.5к/мес ($1.9к - $3.1к)
88
Отличная вакансия
развернуть
Чётко очерченная техническая роль в разработке передовых полупроводников с самостоятельной ответственностью и влиянием на смежные команды; основной компромисс - обязательная работа на площадке.
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Thin Films Module Development Engineer (Semiconductor): Developing and delivering metals modules for advanced semiconductor technologies with an accent on process optimization, defect reduction, equipment metrology, and hardware-material integration. Focus on formulating technical problem statements, leading data-driven development roadmaps, and delivering process solutions for advanced technology nodes and manufacturing ramps.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $155,520–$255,200 USD
Company
hirify.global Foundry develops and manufactures advanced semiconductor technologies.
What you will do
Develop and deliver metals modules for advanced semiconductor technologies.
Combine hardware knowledge and process expertise to meet program process needs within hardware capabilities.
Formulate concise technical problem statements and establish data-driven roadmaps and timelines.
Lead technical initiatives and collaborate with stakeholders to deliver results on schedule.
Requirements
Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field with 6+ years of experience; or a master’s degree with 4+ years; or a Ph.D. with 2+ years.
Experience in semiconductor manufacturing or process development.
Experience with process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes.
Proficiency in Design of Experiments, Statistical Process Control, and structured problem-solving methodologies.
Hands-on expertise in dry etch processes, material science, and equipment metrology.
Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials.
Nice to have
Doctoral degree in a relevant engineering or science field.
Experience with sub-10nm technology nodes and FinFET or Gate-All-Around device architectures.
Experience delivering process solutions in Technology Development and High Volume Manufacturing.
Cross-functional leadership in yield improvement, defect reduction, or technology ramp initiatives.
Experience mentoring engineers and providing technical guidance.
Ability to lead initiatives from concept through implementation.
Culture & Benefits
Full-time experienced-hire position with on-site work required.
Benefits include health coverage, retirement programs, and vacation.
Total compensation may include competitive pay and stock bonuses.
Shift 1 schedule in the United States.
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