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5 дней назад

Thin Films Module Development Engineer (Semiconductor)

155 520 - 255 200$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Thin Films Module Development Engineer (Semiconductor): Developing and delivering metals modules for advanced semiconductor technologies with an accent on process optimization, defect reduction, equipment metrology, and hardware-material integration. Focus on formulating technical problem statements, leading data-driven development roadmaps, and delivering process solutions for advanced technology nodes and manufacturing ramps.

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $155,520–$255,200 USD

Company

hirify.global Foundry develops and manufactures advanced semiconductor technologies.

What you will do

  • Develop and deliver metals modules for advanced semiconductor technologies.
  • Combine hardware knowledge and process expertise to meet program process needs within hardware capabilities.
  • Formulate concise technical problem statements and establish data-driven roadmaps and timelines.
  • Lead technical initiatives and collaborate with stakeholders to deliver results on schedule.

Requirements

  • Bachelor’s degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related STEM field with 6+ years of experience; or a master’s degree with 4+ years; or a Ph.D. with 2+ years.
  • Experience in semiconductor manufacturing or process development.
  • Experience with process optimization, defect reduction, and manufacturing process improvements for advanced technology nodes.
  • Proficiency in Design of Experiments, Statistical Process Control, and structured problem-solving methodologies.
  • Hands-on expertise in dry etch processes, material science, and equipment metrology.
  • Technical experience with semiconductor manufacturing equipment and collaboration with suppliers to optimize hardware and materials.

Nice to have

  • Doctoral degree in a relevant engineering or science field.
  • Experience with sub-10nm technology nodes and FinFET or Gate-All-Around device architectures.
  • Experience delivering process solutions in Technology Development and High Volume Manufacturing.
  • Cross-functional leadership in yield improvement, defect reduction, or technology ramp initiatives.
  • Experience mentoring engineers and providing technical guidance.
  • Ability to lead initiatives from concept through implementation.

Culture & Benefits

  • Full-time experienced-hire position with on-site work required.
  • Benefits include health coverage, retirement programs, and vacation.
  • Total compensation may include competitive pay and stock bonuses.
  • Shift 1 schedule in the United States.

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