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5 дней назад

Senior Technical Marketing Manager (Advanced Packaging)

174 000 - 239 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
Senior Technical Marketing Manager (Advanced Packaging): Defining value propositions, competitive positioning, and customer adoption strategies for advanced semiconductor packaging process-control solutions with an accent on technical marketing assets, market intelligence, and cross-functional product strategy. Focus on translating complex BEOL/FEOL and packaging concepts into executive messaging, leading competitor evaluations, and driving product readiness and sales enablement.

Location: Santa Clara, CA, United States. Full-time onsite role with 25% travel; relocation eligible.

Salary: $174,000–$239,500 per year. Additional bonus and stock award compensation may apply.

Company

hirify.global provides materials science and engineering solutions and equipment for semiconductor chips and advanced displays, including technologies supporting AI and next-generation semiconductor commercialization.

What you will do

  • Define value propositions and competitive positioning for advanced semiconductor packaging process-control solutions.
  • Create product briefs, solution whitepapers, competitive analyses, benchmark summaries, presentations, and webinars.
  • Translate complex engineering concepts into clear messaging for varied audiences and enable sales teams.
  • Conduct market sizing, segmentation, trend analysis, and competitive intelligence for advanced packaging ecosystems.
  • Develop application use cases, lead competitor head-to-head evaluations, and support roadmap prioritization and product adoption.
  • Partner with product marketing, engineering, corporate marketing, operations, and manufacturing on product strategy, launches, readiness, and customer alignment.

Requirements

  • MS or PhD in Engineering, Physics, Materials Science, or a related discipline.
  • 10+ years of experience in semiconductor manufacturing or packaging, including direct BEOL/FEOL exposure.
  • Demonstrated expertise in advanced packaging ecosystems and customer workflows.
  • Strong analytical and communication skills, including executive storytelling and data-driven decision-making.
  • Experience leading cross-functional projects to milestones in a matrix environment.
  • Strategic, enterprise-level thinking; a solutions-first mindset; and the ability to simplify complex technology.
  • Ability to operate autonomously and influence without authority in fast-paced, high-ambiguity environments.

Nice to have

  • Hands-on inspection or metrology background.
  • Experience with pricing strategy, product launches, and field enablement.
  • Familiarity with reliability, yield, and metrology or inspection data related to packaging performance.

Culture & Benefits

  • Supportive culture focused on learning, development, and career growth.
  • Comprehensive benefits supporting employee health and wellbeing.
  • Regular full-time employment with eligibility for bonus and stock award programs, as applicable.
  • Travel required for 25% of the time.
  • Equal opportunity employment and accessibility support are available.

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