Packaging Module Development Engineer (Semiconductor Packaging)
Контакты
155 520 - 219 550$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
data analysisprocess improvementprocess developmentequipment qualificationmetrologyroot cause analysisstatistical process controladvanced packagingsemiconductor manufacturing
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
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$156к-220к/год
$180к$190кмедиана$210к
По похожим ролям (50) ~ $190к/год
На СНГ рынке: $2.5к/мес ($1.9к - $3.1к)
87
Отличная вакансия
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Чётко очерченная инженерная роль уровня senior в крупной полупроводниковой компании с работой над передовыми технологиями упаковки; главный компромисс - обязательное присутствие на площадке.
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Packaging Module Development Engineer (Semiconductor Packaging): Developing and optimizing advanced metrology capabilities, equipment, and manufacturing processes for next-generation semiconductor packaging with an accent on equipment qualification, recipe development, SPC, and process stability. Focus on evaluating emerging technologies, solving manufacturing process excursions, and improving yield and manufacturing readiness.
Location: On-site in Hillsboro, Oregon, United States
Annual salary: $155,520–$219,550 USD
Company
hirify.global develops semiconductor technologies and advanced packaging solutions.
What you will do
Develop and execute metrology technology roadmaps, feasibility studies, process evaluations, and pathfinding initiatives.
Install, qualify, characterize, and validate metrology and inspection equipment for manufacturing readiness.
Own and optimize equipment and manufacturing processes through troubleshooting, recipe development, process monitoring, and continuous improvement.
Develop metrology modules using recipe optimization, process parameter evaluation, statistical process control, and sampling strategies.
Investigate process excursions, perform root cause analysis, and implement corrective actions to improve yield, stability, and efficiency.
Collaborate with process integration, manufacturing, automation, advanced process control teams, and equipment suppliers on technology development and technical challenges.
Requirements
Bachelor’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related STEM field, plus 6+ years of semiconductor manufacturing experience.
Alternatively, a relevant master’s degree plus 4+ years of semiconductor manufacturing experience, or a PhD plus 2+ years of semiconductor manufacturing experience.
Experience must include manufacturing process development and application of statistical process control, data analysis, and/or process improvement methodologies.
Nice to have
Experience owning, sustaining, or optimizing semiconductor metrology or inspection equipment, including equipment recipes and process performance.
Experience with technology development initiatives, equipment capability evaluations, or future technology roadmaps.
Recognized technical leadership and the ability to solve complex engineering challenges.
Strong collaboration skills across yield, operations, supplier management, and other cross-functional teams.
Culture & Benefits
On-site presence is required.
Full-time experienced-hire position on Shift 1 in the United States.
Benefits include health coverage, retirement programs, vacation, competitive pay, and stock bonuses.
hirify.global follows responsible business and ethical hiring practices and does not charge recruitment or employment-related fees.
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