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8 часов назад

Process Engineer E4 (Semiconductor)

147 000 - 202 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Релокация
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

Текст:
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TL;DR
Process Engineer E4 (Semiconductor): Designing and optimizing PVD processes and advanced semiconductor manufacturing technologies with an accent on hardware characterization, materials analysis, and device-wafer fabrication. Focus on troubleshooting complex process issues, performing root cause analysis, collaborating across lithography, etch, CMP, and device teams, and developing materials and devices for quantum information applications.

Location: Santa Clara, CA, United States of America. Onsite role with a 10-day, 8-hour shift and 10% travel. Relocation eligibility is stated inconsistently as both eligible and not eligible.

Salary: $147,000.00–$202,500.00 per year.

Company

hirify.global develops materials science, engineering, semiconductor manufacturing, and advanced display technologies, including materials and devices for quantum information applications.

What you will do

  • Design experiments, collect and analyze data, compile technical reports, and follow all safety requirements.
  • Conduct hardware characterization on advanced systems and measure material and device properties.
  • Develop and characterize PVD processes on Applied MDP chambers for device-wafer fabrication.
  • Collaborate with lithography, etch, device, integration, R&D, vendor, and supplier teams across multiple projects.
  • Troubleshoot complex process-engineering problems, perform root cause analysis, and resolve customer issues with limited supervision.
  • Implement new technologies, products, and analytical instrumentation while preparing internal and external documentation.

Requirements

  • Bachelor’s degree.
  • 7–10 years of experience.
  • Conceptual and practical expertise in process engineering and basic knowledge of related disciplines.
  • Strong understanding of metal deposition technologies including PVD and ECD, dielectric and metal CMP, CMOS interconnects, and advanced packaging metallization flows and challenges.
  • General knowledge of DUV lithography and plasma etch processes.
  • Ability to solve complex problems using analysis from multiple information sources and exercise sound judgment.
  • Ability to explain difficult or sensitive information, build consensus, and collaborate regularly with cross-functional teams.
  • Ability to act as a resource for less experienced colleagues and potentially lead small projects.

Culture & Benefits

  • Supportive culture focused on learning, professional development, inclusion, and career growth.
  • Comprehensive employee health and wellbeing programs and benefits.
  • Additional compensation may include bonus and stock awards, as applicable.
  • Regular full-time employment with 10% travel and an 8-hour shift schedule.

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