process engineeringroot cause analysisquantum computingcmospvdcmpsemiconductor manufacturinghardware characterizationecd
Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$147к-203к/год
$140к$160кмедиана$180к
По похожим ролям (50) ~ $160к/год
На СНГ рынке: $2.5к/мес ($1.9к - $3.1к)
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Чётко описанная senior-роль в сфере технологических процессов у ведущей компании по производству оборудования для полупроводниковой отрасли, с работой над передовыми технологиями; при этом формат работы полностью очный, а условия переезда указаны противоречиво.
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Переезд неясенЧёткий уровень ролиЛидер отрасли
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Process Engineer E4 (Semiconductor): Designing and optimizing PVD processes and advanced semiconductor manufacturing technologies with an accent on hardware characterization, materials analysis, and device-wafer fabrication. Focus on troubleshooting complex process issues, performing root cause analysis, collaborating across lithography, etch, CMP, and device teams, and developing materials and devices for quantum information applications.
Location: Santa Clara, CA, United States of America. Onsite role with a 10-day, 8-hour shift and 10% travel. Relocation eligibility is stated inconsistently as both eligible and not eligible.
Salary: $147,000.00–$202,500.00 per year.
Company
hirify.global develops materials science, engineering, semiconductor manufacturing, and advanced display technologies, including materials and devices for quantum information applications.
What you will do
Design experiments, collect and analyze data, compile technical reports, and follow all safety requirements.
Conduct hardware characterization on advanced systems and measure material and device properties.
Develop and characterize PVD processes on Applied MDP chambers for device-wafer fabrication.
Collaborate with lithography, etch, device, integration, R&D, vendor, and supplier teams across multiple projects.
Troubleshoot complex process-engineering problems, perform root cause analysis, and resolve customer issues with limited supervision.
Implement new technologies, products, and analytical instrumentation while preparing internal and external documentation.
Requirements
Bachelor’s degree.
7–10 years of experience.
Conceptual and practical expertise in process engineering and basic knowledge of related disciplines.
Strong understanding of metal deposition technologies including PVD and ECD, dielectric and metal CMP, CMOS interconnects, and advanced packaging metallization flows and challenges.
General knowledge of DUV lithography and plasma etch processes.
Ability to solve complex problems using analysis from multiple information sources and exercise sound judgment.
Ability to explain difficult or sensitive information, build consensus, and collaborate regularly with cross-functional teams.
Ability to act as a resource for less experienced colleagues and potentially lead small projects.
Culture & Benefits
Supportive culture focused on learning, professional development, inclusion, and career growth.
Comprehensive employee health and wellbeing programs and benefits.
Additional compensation may include bonus and stock awards, as applicable.
Regular full-time employment with 10% travel and an 8-hour shift schedule.
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