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SiP Simulation and Virtual Prototyping Specialist (m/f/d) (Semiconductor Packages)

Формат работы
hybrid
Тип работы
fulltime
Грейд
senior
Английский
c1
Страна
Germany
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Описание вакансии

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TL;DR
SiP Simulation and Virtual Prototyping Specialist (Semiconductor Packages) (SiP/simulation): Establishing multidisciplinary simulation tool chains and building electrical, thermal, mechanical, and thermo-mechanical models for semiconductor packages with an accent on signal integrity, power integrity, reliability, and model correlation. Focus on automating simulation workflows, integrating supplier and partner models, and producing traceable evidence for package architecture and design decisions.

Location: Regensburg, Germany; hybrid and cross-border mobile work are possible.

Company

hirify.global is an independent automotive technology and electronics company developing sensor solutions, displays, braking and comfort systems, software, architecture platforms, and assistance systems for software-defined vehicles.

What you will do

  • Establish and maintain multidisciplinary simulation and electronic design automation tool chains for SiP feasibility and design studies.
  • Define SiP simulation strategies, model requirements, simulation methods, boundary conditions, correlation approaches, and sign-off criteria.
  • Build parameterized electrical, thermal, mechanical, and thermo-mechanical models across dies, interconnects, packages, substrates, interposers, and boards.
  • Perform signal-integrity, power-integrity, thermal, mechanical, thermo-mechanical, and reliability analyses.
  • Correlate models with supplier data, analytical calculations, measurements, and prototype results while documenting limitations and confidence.
  • Automate repeatable workflows, design-space exploration, post-processing, and reporting; maintain simulation libraries, templates, version control, and documentation.

Requirements

  • Academic degree in Electrical Engineering, Microelectronics, or a comparable qualification.
  • In-depth semiconductor technology experience and long-term experience with IC design methodology and EDA tools.
  • Several years of multiphysics simulation experience for semiconductor packages, electronic assemblies, or heterogeneous integration.
  • In-depth experience in at least two areas: signal integrity, power integrity, thermal analysis, mechanical analysis, or thermo-mechanical reliability.
  • Experience with Ansys, Cadence, Siemens, or equivalent industry simulation environments.
  • Deep knowledge of package and substrate structures, material properties, interconnect technologies, and semiconductor package failure mechanisms.
  • Business-fluent English, written and spoken, is required; German language skills are desirable.
  • Initiative, ownership, proactive behavior, continuous learning, communication skills, customer focus, teamwork, analytical thinking, methodological rigor, tool-chain ownership, and cross-domain collaboration.

Nice to have

  • Experience with model-order reduction, compact models, parameter extraction, sensitivity analysis, and design-space exploration.
  • Experience automating simulation workflows and scripting, for example with Python.
  • Experience correlating simulation results with measurements, supplier models, or prototype data.
  • German language skills.

Culture & Benefits

  • Hybrid and cross-border mobile work, flexible working-time models, and a part-time option.
  • Sabbatical options and initiatives supporting compatibility of family and career.
  • Canteens and cafeterias, continuing education and training, health management, and physiotherapy.
  • Work in a highly motivated team on diverse projects in a global automotive environment.
  • Personal and professional development supported through lifelong learning.
  • Applications from severely handicapped people are welcome.

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