SiP System and Design Architect (Automotive)

Location: Regensburg, Germany; hybrid and cross-border mobile work are possible.

Company

hirify.global is an independent automotive technology and electronics company developing sensor solutions, displays, braking and comfort systems, software, architecture platforms, and assistance systems for software-defined vehicles.

What you will do

• Translate product and use-case requirements into SiP functional architectures, chip or chiplet partitions, floorplans, and package-level design concepts.
• Define die-to-die communication, package electrical architecture, substrate constraints, power delivery, high-speed routing, grounding, decoupling, and package-board interfaces.
• Build SystemC and Transaction-Level Modeling executable models for architecture exploration, performance assessment, and interface evaluation.
• Develop system concepts for dataflow, timing, boot, power management, clocking, reset, diagnostics, functional safety, cybersecurity, testability, redundancy, and repair.
• Define test, manufacturability, reliability, and system-level test requirements with experts and external partners.
• Coordinate architecture trade-offs and design reviews across product, IC, software, package, simulation, test, safety, security, manufacturing, and supplier stakeholders while maintaining specifications and reusable SiP guidelines.

Requirements

• Academic degree in Electrical Engineering, Microelectronics, or a comparable qualification.
• In-depth semiconductor technology experience and long-term experience with IC design methodologies and EDA tools.
• Several years of experience in System-on-Chip, multi-die, System-in-Package, or complex embedded-system architecture.
• In-depth experience in system architecture, chip partitioning, performance modeling, interface definition, and hardware/software co-design.
• Profound experience with SystemC, Transaction-Level Modeling, or comparable virtual prototyping and architecture exploration methods.
• Deep knowledge of high-speed die-to-die and package interfaces, including UCIe, protocol concepts, signal and power integrity constraints, and substrate design fundamentals.
• Knowledge of boot, clock, reset, power management, diagnostics, functional safety, cybersecurity interfaces, redundancy, and repair concepts.
• Business-fluent English, written and spoken, is required. German language skills are preferred.
• Initiative, ownership, proactive behavior, continuous learning, flexibility, communication skills, customer focus, motivation, inspiration, and teamwork.

Nice to have

• Experience with package or substrate floorplanning, electrical package design, layout constraints, and design-rule handover.
• Experience in design for test, system-level test concepts, and requirements engineering for automotive electronics.
• German language skills.

Culture & Benefits

• Hybrid and cross-border mobile work, flexible working-time models, part-time work, and sabbaticals.
• Benefits include canteens and cafeterias, continuing education and training, health management, and physiotherapy.
• Support for work-life balance and compatibility of family and career.
• Work with a highly motivated team on diverse topics and projects in the global automotive industry.
• Opportunities for lifelong learning and personal and professional development.
• Applications from severely handicapped people are welcome.