Oregon Advanced Packaging Module Engineer (Semiconductor Manufacturing)

Location: On-site in Hillsboro, Oregon, United States

Annual salary: $76,390–$146,440 USD

Company

hirify.global develops and manufactures technology products, with this role supporting the Oregon Advanced Packaging team within the Wafer Packaging Manufacturing organization.

What you will do

• Own high-volume manufacturing equipment and packaging processes supporting device miniaturization and next-generation integrated circuit production.
• Conduct technical tests and measurements for process control, dimensional control, and inline defectivity.
• Develop and monitor excursion-prevention and discrepant-material detection systems within equipment modules.
• Partner with global manufacturing sites to transfer process qualification outcomes, coordinate training, and align performance metrics.
• Lead initiatives for safety, quality, productivity, cost reduction, and systematic defect reduction.
• Coordinate equipment installations, conversions, qualifications, and supplier collaboration during factory ramps.

Requirements

• Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related STEM field, plus 1+ year of hands-on experience in semiconductor manufacturing or high-tech process equipment; or a Master’s degree in a matching STEM discipline.
• 6+ months of experience applying statistical methods, such as Statistical Process Control or design of experiments, to manufacturing processes.
• Relevant experience may be gained through internships, academic projects, coursework, or hands-on technical training.
• Leadership and collaboration skills for guiding cross-functional teams, influencing global partners, and working across organizational boundaries.
• Analytical problem-solving skills for diagnosing complex electromechanical and process issues using structured data.
• Adaptability in a rapidly changing, fast-paced, high-volume manufacturing environment, with attention to precision, safety, and design-to-target compliance.

Nice to have

• 6+ months of experience troubleshooting equipment or analytical instruments in a semiconductor environment.
• 6+ months of experience using MATLAB, JMP, or Excel for statistical analysis and process optimization.
• 6+ months of experience using materials characterization techniques.

Culture & Benefits

• On-site work supporting hirify.global’s Aloha and Ronler factories in Oregon.
• Competitive pay, stock bonuses, health benefits, retirement benefits, and vacation.
• Work on advanced wafer-level processes and packaging technologies supporting high-volume production and global technology transfer.
• Shift 1 schedule in the United States.