Summer 2027 Mechanical Engineering Intern - Bachelor's (Semiconductor Manufacturing)

Location: Chandler, AZ, United States

Company

hirify.global develops materials science and engineering solutions and equipment used in semiconductor chip and advanced display manufacturing.

What you will do

• Support daily manufacturing engineering and production activities at the Central Repair Center.
• Work with build and test technicians to identify process improvement opportunities and execute time studies.
• Develop and update manufacturing procedures, work instructions, engineering documentation, and manufacturing records.
• Collect and analyze manufacturing data for operational decisions and support cost-reduction initiatives.
• Support root cause analysis, corrective actions, and evaluation of tooling, fixtures, and manufacturing equipment.
• Collaborate with Production, Quality, Supply Chain, and Engineering teams while following safety procedures and manufacturing best practices.

Requirements

• Currently pursuing or recently completed a Bachelor's Degree in Mechanical Engineering, Manufacturing Engineering, Industrial Engineering, Mechanics, Industrial Production, or a related field.
• Basic understanding of mechanical systems and manufacturing processes.
• Ability to read and interpret mechanical drawings and technical documentation.
• Good analytical and problem-solving skills, including the ability to exercise judgment based on multiple sources of information.
• Proficiency in Microsoft Office applications, particularly Excel and PowerPoint.
• Good communication skills and ability to work in a team environment.
• Interest in manufacturing, operations, and continuous improvement.
• Proactive, curious, flexible, and adaptable mindset with willingness to learn in a fast-paced, results-driven environment.

Culture & Benefits

• Full-time summer 2027 internship for students or recent graduates.
• Hands-on experience in a high-tech manufacturing environment with support from experienced engineers and technicians.
• Supportive work culture focused on learning, development, and practical technical experience.
• Benefits package and potential eligibility for bonus and stock award programs, as applicable.
• No travel and no relocation eligibility.

Hiring process

• Applications are reviewed on a rolling basis.
• Apply by December 31, 2026; the position may close early based on application volume or candidate selection.