Senior Package Layout Engineer (Semiconductor)

Location: Ottawa, Ontario, Canada; other listed locations include Calgary and Burlington, Canada, and Aguascalientes, Mexico.

Salary: CAD 105,000–122,000 per year.

Company

hirify.global designs semiconductor solutions and intellectual property cores for consumer connectivity and datacenter products.

What you will do

• Perform package design feasibility assessments with signal integrity, manufacturing, and thermo-mechanical engineering teams.
• Develop multi-layer substrate and carrier layouts for 2D, 2.5D, and 3D IC configurations.
• Develop wafer-level interconnect layouts using wafer redistribution layers and wafer reconstruction technologies.
• Coordinate with cross-functional internal teams and local and international suppliers.
• Own package or PCB layouts from feasibility through release to fabrication.

Requirements

• Bachelor’s degree in engineering, physics, or another relevant discipline.
• At least 5 years of layout experience in high-speed package and/or advanced PCB technologies.
• Solid knowledge of high-speed layout and electronic design.
• Advanced knowledge of EDA layout tools.
• Familiarity with PCB layout and mechanical, thermal, and optical design.
• Understanding of RF, analog, and digital circuits.
• Ability to work in parallel with several cross-functional teams and coordinate with local and international suppliers.
• Excellent written and oral communication skills; ability to collaborate effectively.
• Ability to work independently with little supervision in a fast-paced environment.

Nice to have

• Advanced knowledge of Cadence APD and Allegro.
• Knowledge of AI design acceleration features in EDA layout tools.
• Additional degrees or certifications in mechatronics, photonics, or electronics manufacturing.
• Familiarity with chip-on-board, wirebond, flip-chip, optical assembly, and high-speed connector configurations.
• Familiarity with JEDEC and IPC standards.
• Experience troubleshooting PCBs and systems.
• Creativity, determination, and innovation.

Culture & Benefits

• Full-time role within the Signal Integrity Products business unit’s R&D hardware design team.
• Work includes collaboration with local and international suppliers and multiple internal engineering teams.
• Progression expectations include learning design flows, EDA tools, and the supplier ecosystem during the first three months.
• Within six months, independently own package or PCB layouts through fabrication release; within 12 months, become a contributor in 2.5D/3D IC, wafer-level, or another technology.
• hirify.global values Success, Ethics, Respect, Alignment, diversity, knowledge, and expertise.