Principal Device Engineer (Semiconductor)

Location: Malta, New York, USA. Full-time, onsite role.

Salary: $85,000–$146,000 per year.

Company

hirify.global develops CMOS technology platforms and advanced semiconductor device solutions.

What you will do

• Lead the design, planning, execution, and analysis of experiments for advanced CMOS, FinFET, RF, and derivative device technologies.
• Define device roadmaps, electrical targets, performance metrics, characterization methodologies, test structures, and measurement plans.
• Analyze electrical, physical, reliability, variability, yield, and qualification data to identify optimization opportunities and process improvements.
• Provide technical leadership for device architecture, reliability enhancement, technology qualification, production release, and derivative product activities.
• Collaborate with process integration, FEOL, modeling, reliability, product engineering, DTCO, design enablement, and global engineering teams.
• Engage customers and senior leadership, support patents and publications, and drive technical reviews, mentoring, automation, and strategic technology planning.

Requirements

• Ph.D. or M.S. degree in Electrical Engineering, Materials Science, Physics, Semiconductor Engineering, or a related field.
• Extensive experience in semiconductor device engineering, technology development, or advanced process development.
• Strong understanding of semiconductor device physics and electrical characterization methods.
• Proven experience designing and analyzing design-of-experiments for technology development and optimization.
• Expertise in CMOS, FinFET, RF, analog, memory, or advanced semiconductor device technologies.
• Strong analytical and problem-solving skills, including interpretation of complex electrical and physical characterization data.
• Experience collaborating across multidisciplinary engineering organizations and leading technical projects while influencing decisions across organizations.
• Excellent verbal and written communication skills and fluent English communication.

Nice to have

• Knowledge of FEOL process integration, including gate stack, implant, junction engineering, mobility enhancement, spacer formation, silicide processes, and advanced device architectures.
• Experience with reliability mechanisms, variability analysis, technology qualification, advanced statistical analysis, and large-scale data interpretation.
• Programming and automation experience with Python, JMP/JSL, R, SQL, or similar tools.
• Experience with parameter analyzers, source measurement units, wafer probing systems, SPICE modeling, model validation, and model-hardware correlation.
• Patent, publication, or industry-recognized technical contribution record; experience presenting to customers and executive leadership.
• Experience leading cross-functional technical teams, mentoring engineers, or supporting automotive, RF, eNVM, AI, or advanced compute technologies.

Culture & Benefits

• Work is performed in accordance with Environmental, Health, Safety, and Security requirements.
• The role includes collaboration across global development and manufacturing sites.
• Employment offers are subject to applicable pre-employment conditions, laws, and regulations.
• Reasonable accommodation is available during the employment process upon request.
• hirify.global states its commitment to equal opportunity and nondiscrimination.