Packaging Engineer (Semiconductor)

Location: Rehovot, Israel; onsite role.

Company

hirify.global develops, manufactures, and markets materials science, semiconductor equipment, and machine learning and computer vision-based metrology and inspection products.

What you will do

• Lead the development and design of packaging equipment and materials for safe, cost-effective transport under varied environmental, shipment, and storage conditions.
• Support packaging activities throughout the product lifecycle, including material selection, qualification, procedures, and operational alignment.
• Develop temporary, alternative, legacy, and end-of-life packaging configurations where standards are not established.
• Resolve packaging issues involving cleanroom environments, contamination control, cleanliness protocols, handling, transportation, and installation.
• Collaborate with engineering, manufacturing, logistics, suppliers, and field teams to ensure packaging readiness and compliance.
• Lead root-cause analysis, corrective actions, and continuous improvement to increase packaging efficiency, product protection, cost effectiveness, and operational performance.

Requirements

• 3–5 years of experience in mechanical design.
• Project management capabilities and the ability to lead and manage technical projects.
• Experience with CAD tools, including SolidWorks and Inventor.
• Knowledge of Teamcenter and other operational systems.
• Motivation, passion, teamwork, collaboration, self-learning, and the ability to work independently.

Nice to have

• Packaging design experience.

Culture & Benefits

• Supportive, challenging work environment with opportunities to learn, develop, and grow.
• Close collaboration with R&D, manufacturing, materials, industrial engineering, supplier engineering, and other operations teams.
• Employee health and wellbeing programs supporting personal and professional growth.
• Regular employment with full-time working hours; relocation is not eligible.