Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
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Зарплата и рынок
$122к-195к/год
$140к$160кмедиана$190к
По похожим ролям (50) ~ $160к/год
На СНГ рынке: $2.5к/мес ($1.9к - $3к)
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Отличная вакансия
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Чётко очерченная роль в физическом проектировании передовых ASIC у крупного производителя чипов, с ответственностью до tape-out; основные компромиссы - высокие требования к опыту и работа в офисе.
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Высокий порог входаЧипы для ИИАктуальные EDA-инструменты
Оценка от Hirify AI
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Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Senior Physical Design Engineer (AI/ASIC): Developing and taping out advanced AI and PCIe switch ASICs from RTL through GDSII with an accent on floorplanning, placement, clock-tree synthesis, routing, timing closure, and power integrity across 5nm, 3nm, and 2nm nodes. Focus on MCMM static timing analysis, signal integrity, IR-drop and electromigration optimization, and advanced chiplet-based silicon implementation.
Location: San Jose, California, United States; onsite role
Annual base salary: USD 121,900–195,000
Company
hirify.global's ASIC Products Division develops custom high-performance silicon solutions for hyperscale cloud providers, AI companies, and networking infrastructure leaders.
What you will do
Lead block-level and top-level physical design implementation from floorplanning through GDSII stream-out using Cadence Innovus.
Execute placement, clock-tree synthesis, routing, and timing and power optimization on 5nm, 3nm, and 2nm technology nodes.
Perform MCMM static timing analysis, signal integrity optimization, and power-grid signoff including static and dynamic IR-drop and electromigration analysis.
Drive physical design for next-generation AI and PCIe switch products from RTL to silicon tape-out.
Automate physical design flows and database manipulation using Tcl, Python, and Unix shell scripting.
Provide technical leadership, solve complex implementation problems, and collaborate cross-functionally.
Requirements
B.S. or M.S. degree in Electrical Engineering, Computer Engineering, or a related technical field.
8+ years of hands-on physical design experience with successful tape-outs of complex, high-frequency, ultra-large-scale networking or AI ASICs.
Direct tape-out experience with TSMC advanced nodes N7, N5, and N3, or equivalent foundry processes.
High proficiency with Cadence Innovus for place-and-route.
High proficiency with Synopsys PrimeTime or Cadence Tempus for timing and static timing analysis.
Experience with StarRC or QRC for extraction and RedHawk for IR/EM analysis.
Experience with Siemens Calibre for DRC/LVS.
Advanced Tcl, Python, and Unix shell scripting skills.
Excellent technical leadership, problem-solving, and cross-functional communication skills.
Nice to have
Strong background in high-speed clock network implementation, including H-tree, mesh, and low-power clock-tree synthesis.
Experience with power-aware implementation flows, including UPF/CPF, multi-voltage domains, and clock or power gating.
Culture & Benefits
Discretionary annual bonus and competitive new-hire and annual equity awards, subject to applicable plan documents.
Medical, dental, and vision plans.
401(k) participation with company matching and an Employee Stock Purchase Program.
Employee Assistance Program, company-paid holidays, paid sick leave, vacation time, and applicable paid family leave.
Equal opportunity employment consideration in accordance with federal, state, and local law.
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