Signal and Power Integrity Intern, MS - Summer 2027 (Semiconductor)

Location: On-site in Santa Clara, CA, United States

Expected base pay: $37–$73 per hour

Company

hirify.global develops semiconductor solutions and advanced package designs for data infrastructure, cloud, AI, carrier architectures, and photonic fabric products.

What you will do

• Work on a portion of an advanced packaging design for photonic fabric products, including CPO and NPO platforms.
• Define template-based modeling and simulation flows to automate channel and packaging analysis.
• Apply templates to automate modeling with various field solvers.
• Build automation flows linking package models to simulation decks.

Requirements

• Currently enrolled in a Bachelor's or Master's degree in Electrical Engineering or a related field, with expected graduation between Fall 2027 and Summer 2028.
• Prior coursework in electronics, circuit design, and programming.
• Knowledge of circuit design and analysis.
• Understanding of chip physical integration and layout concepts.
• Skills in circuit simulation tools such as SPICE and Matlab.
• Familiarity with Cadence Allegro, Ansys HFSS, Siwave, and Sigrity.
• Understanding of IBIS and S-parameter models.
• Strong analytical skills.
• Familiarity with Python for automation or scripting.
• Applicants must be eligible to access export-controlled technology or software under applicable U.S. export control laws; an export license review may be required for some applicants.

Culture & Benefits

• On-site work with opportunities to learn and contribute to advanced semiconductor and photonic packaging design.
• Medical, dental, and vision coverage for interns.
• Perks and discounts, mental health resources, and paid holidays.
• Additional compensation may be available for intern PhD candidates.

Hiring process

• Interviews evaluate individual experience, thought process, and communication skills.
• AI tools, transcription apps, automated answer generators, and automated note-taking bots are prohibited during interviews.