Module Engineering - Day Shift 5 or 7 (Semiconductor Packaging)

Location: On-site in Chandler or Phoenix, Arizona, United States. Day Shift 5 or 7, 6:00 AM–6:00 PM on a compressed work week.

Annual salary: $99,030–$139,810 USD.

Company

hirify.global's Foundry Technology Manufacturing business develops advanced packaging solutions for global foundry customers and semiconductor products.

What you will do

• Design and develop assembly processes and hardware configurations for next-generation foundry packaging technologies.
• Develop, calibrate, and maintain equipment for evaluating silicon and packaging technologies under thermal, humidity, heat, and mechanical stress conditions.
• Define raw material specifications for contract assemblers and vendors and partner with supplier quality and procurement on process compliance.
• Create reliability screening, acceleration, and quality-screening methods for early detection of packaging defects.
• Apply Statistical Process Control (SPC) and Design of Experiments (DOE) to define equipment specifications, optimize yields, and document results in technical white papers.
• Support design-for-manufacturability, package manufacturing procedures, customer technical consultations, and standardization of qualification and manufacturing quality systems.

Requirements

• Bachelor's degree in Mechanical Engineering, Materials Science Engineering, Chemical Engineering, Electrical Engineering, or a related STEM field with at least 1 year of relevant experience, or a master's degree in one of these fields.
• At least 6 months of experience with Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles.
• Customer-focused approach to understanding and delivering specialized technical solutions.
• Analytical problem-solving skills for mechanical, thermal, and materials-related packaging defects.
• Ability to collaborate across matrixed teams, global engineering groups, and external supplier networks.
• Initiative to lead continuous improvement projects and adapt to changing product priorities.
• This position is not eligible for hirify.global immigration sponsorship.

Nice to have

• At least 1 year of experience working in a technology development or semiconductor manufacturing environment.
• At least 1 year of experience with semiconductor packaging processes, including assembly, material selection, or reliability engineering in a foundry context.

Culture & Benefits

• Work with global engineering groups, technology development teams, suppliers, and foundry customers.
• Benefits include health coverage, retirement benefits, vacation, competitive pay, and stock bonuses.
• Work is performed on-site in a compressed daytime shift schedule.
• hirify.global maintains responsible business and ethical hiring practices and does not charge recruitment or medical examination fees.