Solutions Architect Engineer (AE)

Location: United States; remote or hybrid. Approximately 2%–5% travel depending on customer demand and business needs.

Annual salary range for California: $162,400–$301,600, plus potential incentive compensation, bonus, equity, and benefits.

Company

hirify.global develops technology solutions for the semiconductor and electronic design industries.

What you will do

• Provide technical leadership and application support for hirify.global 3D-IC and advanced packaging design solutions.
• Help semiconductor companies, OSATs, foundries, and system companies develop package architectures, design implementations, methodologies, and production deployments.
• Develop and demonstrate workflows for organic substrates, silicon interposers, wafer-level packaging, 2.5D and 3D-IC integration, and chiplet-based architectures.
• Support customer evaluations, proof-of-concepts, benchmarks, technical presentations, demonstrations, workshops, and training.
• Collaborate with sales on technical pre-sales activities and with R&D on customer requirements, enhancement requests, and future technology needs.
• Develop best practices, application notes, reference flows, customer-success methodologies, and product direction for advanced packaging.

Requirements

• Bachelor’s degree in Electrical or Electronics Engineering or a related discipline; a Master’s degree is preferred.
• 10+ years of experience in semiconductor packaging, IC packaging, PCB, substrate, or interposer design.
• Strong knowledge of advanced package design methodologies, 2.5D and 3D-IC integration, chiplet-based architectures, package manufacturing and assembly, high-speed signal design, and power delivery networks.
• Experience with package layout, routing, constraint management, and package signoff.
• Understanding of package stackups, bump planning, escape routing, and substrate technologies.
• Experience with design-signoff methodologies including DRC/LVS, connectivity verification, electrical rule checking, thermal analysis, signal integrity, and power integrity.
• Excellent customer-facing communication and presentation skills.
• Ability to work independently while collaborating across global teams.

Nice to have

• Experience with hirify.global Integrity 3D-IC Platform, hirify.global Sigrity, Clarity 3D Solver, or hirify.global Allegro X APD.
• Knowledge of UCIe, HBM, AI accelerator packaging, and heterogeneous integration.
• Experience supporting foundry and OSAT design flows.
• Understanding of semiconductor assembly, reliability, and manufacturing processes.

Culture & Benefits

• Work focused on solving complex technology challenges and developing semiconductor design solutions.
• Remote or hybrid work arrangement in the United States.
• Paid vacation and paid holidays.
• 401(k) plan with employer match, employee stock purchase plan, and medical, dental, and vision plan options.
• Potential bonus, equity, and other incentive compensation; sales positions generally include an OTE structure.