Principal IC Package Design Engineer (Ethernet)

Location: San Jose, CA; hybrid work arrangement.

Annual base salary: $200,000–$265,000, plus pre-IPO ISO options and benefits.

Company

hirify.global develops Ethernet-based networking and acceleration technology for software-defined and autonomous vehicles, robotics, and other intelligent machines.

What you will do

• Lead package architecture and feasibility, including package concepts, substrate stack-ups, bump and ball maps, and pinouts optimized for cost, electrical performance, and thermal constraints.
• Design complex, high-speed, multilayer FCBGA, FCCSP, and SiP packages using industry-standard EDA tools.
• Perform SI/PI and thermal co-design for 56G/112G+ SerDes, power delivery networks, and thermal dissipation.
• Define substrate design rules, optimize routing, and manage DFM/DFA and manufacturing constraints.
• Lead technical engagements with substrate suppliers and OSAT vendors through NPI and production ramp.
• Coordinate chip-package-board co-design across Silicon IC Design, Systems/PCB, Reliability, Thermal, and external partners while influencing the packaging technology roadmap.

Requirements

• B.S. in Electrical Engineering, Materials Science, Mechanical Engineering, or a related field.
• 10+ years of direct experience in IC package design and architecture, ideally in high-speed networking, automotive electronics, or high-performance computing.
• Proven experience delivering high-volume, complex FCBGA, SiP, and MCM designs.
• Expert proficiency with package design suites such as Cadence Allegro Package Designer, SiP Layout, or Synopsys 3DIC Compiler.
• Strong understanding of electromagnetic theory, transmission lines, crosstalk, and PDN concepts.
• Deep knowledge of substrate fabrication processes, assembly line limits, and automotive-grade reliability standards such as AEC-Q100 guidelines.
• Strong problem-solving abilities with a data-driven approach to architectural trade-offs involving performance, cost, and yield.
• Excellent communication skills for explaining complex packaging constraints to cross-functional executives and external partners.

Nice to have

• Familiarity with extraction tools such as Ansys HFSS/Q3D or Cadence Clarity.
• Experience in high-speed networking, automotive electronics, or high-performance computing.

Culture & Benefits

• Opportunity to work on cutting-edge packaging and networking technology in a growing startup.
• Career growth opportunities and exposure to broad technology areas.
• Pre-IPO stock options.
• Flexible hours.
• Medical, dental, and vision insurance for employees.
• Competitive base salary and incentive compensation.