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2 дня назад

Mechanical/Hardware Engineer (Thermal)

95 800 - 220 500$
Формат работы
onsite
Тип работы
fulltime
Грейд
middle
Английский
c1
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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Текст:
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TL;DR
Mechanical/Hardware Engineer (Thermal) (Thermal Engineering/Server Hardware): Developing cost-effective cooling solutions for server designs, including system-level thermal design, mechanical design, thermal simulation, mockups, and validation with an accent on fan and heatsink technology, materials science, fluid flow, and control logic. Focus on leading complex mechanical and thermal development projects, validating solutions with CFD and thermal mockups, integrating new technologies, and resolving technical issues with vendors and development partners.

Location: Onsite in Chippewa Falls, Wisconsin, United States of America.

Salary: USD 95,800–220,500 annual base salary in Wisconsin. Variable incentives may also be offered.

Company

hirify.global is a global edge-to-cloud company developing solutions that connect, protect, analyze, and act on data and applications.

What you will do

  • Lead multiple project teams through all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling, and testing.
  • Develop cost-effective cooling solutions for server designs, covering fan and heatsink technology, materials science, chemistry, fluid flow, and system-level control logic.
  • Perform or oversee initial concept work, mechanical design, thermal simulation using FloTHERM or other software, thermal mockups with dummy heat loads, and solution validation.
  • Manage relationships with internal and outsourced development partners and interface with vendors on technical issues.
  • Review designs and project activities for compliance with development standards, provide feedback to improve product quality, and drive integration of new technologies.
  • Provide mechanical and thermal leadership, mentor less-experienced staff, and communicate design proposals and product architectures across organizations.

Requirements

  • Bachelor’s or Master’s degree in Mechanical Engineering.
  • Typically 4–6 years of experience.
  • Proficiency with ProEngineer, SolidWorks, or other 3D CAD software for mechanical design.
  • Strong analytical and problem-solving skills.
  • Strong understanding of and experience with electronics packaging.
  • Experience designing sheet metal and plastic parts, including associated production tooling and processes.
  • Experience using CFD and thermal mockups to validate thermal solutions.
  • Excellent written and verbal communication skills, with mastery of English and the local language.
  • Ability to communicate product architectures and design proposals effectively and negotiate options at management levels.
  • Ability to work independently and as part of a team, learn new tasks and technologies, and develop risk-management skills for assessing risk and subcontractor and vendor performance.

Culture & Benefits

  • Onsite work primarily from an HPE office.
  • Health and wellbeing benefits supporting physical, financial, and emotional wellbeing.
  • Personal and professional development programs supporting career growth and movement across divisions.
  • Inclusive workplace focused on varied backgrounds, individual uniqueness, flexibility, and collaboration.
  • Some foreign travel is required.

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