Вакансия из Hirify Global, списка международных tech-компаний Для мэтча и отклика нужен Plus
Пожаловаться
Зарплата и рынок
$181к-367к/год
$160к$210кмедиана$230к
По похожим ролям (50) ~ $210к/год
85
Хорошая вакансия
развернуть
В HPE предлагают чётко очерченную и технически сложную работу над сетевым и AI-оборудованием, но крайне широкий набор требований и работа в офисе подойдут не всем.
Кликните для подробной информации
Планка требованийПередовые системыПолный цикл разработкиРабота в офисе
Оценка от Hirify AI
Мэтч & Сопровод
Для мэтча с этой вакансией нужен Plus
Подключить Plus
Описание вакансии
Текст:
Hirify AI/Оригинал
TL;DR
Senior Principal Hardware Engineer (high-speed networking hardware/FPGA): Designing next-generation networking hardware and liquid-cooled scale-up systems from architecture through production with an accent on high-bandwidth signaling, dense high-power PCBs, FPGA integration, and SI/PI analysis. Focus on developing 100G/200G-plus interconnects, solving electrical, thermal, and mechanical constraints, and integrating liquid cooling into high-performance computing and AI/ML architectures.
Location: Onsite in Sunnyvale, California, United States
Base salary: USD 181,000–367,000 annually in California; variable incentives may also be offered.
Company
hirify.global is an edge-to-cloud technology company developing solutions that connect, protect, analyze, and act on data and applications.
What you will do
Own the end-to-end hardware design lifecycle from system architecture and concept development through schematic design, PCB layout, bring-up, validation, qualification, and production.
Lead high-performance, high-density, high-power circuit-board design with demanding electrical, thermal, and mechanical constraints.
Design systems using 100G, 200G, and higher-speed serial signaling and interconnects.
Develop and review schematics, power architectures, clocking solutions, high-speed interfaces, and board-level architectures.
Design FPGA solutions, including device selection, configuration, interfaces, implementation, bring-up, and hardware/firmware integration.
Drive signal integrity and power integrity analysis, liquid-cooled scale-up architectures, and cross-functional solutions with thermal, mechanical, firmware, software, and manufacturing teams.
Requirements
10+ years of hands-on hardware or board-design experience with complex, high-performance electronic systems.
10+ years of experience designing high-speed systems with 100G/200G-class signaling or comparable high-bandwidth interfaces.
10+ years of experience designing high-power, extremely dense PCBs and electronic systems.
10+ years of hands-on FPGA design experience, including independently designing and implementing FPGA-based solutions.
10+ years of strong knowledge of signal integrity and power integrity principles.
10+ years of experience with scale-up systems and high-performance computing, networking, AI/ML, accelerator, or similarly demanding architectures.
10+ years of experience with liquid cooling systems, including liquid-cooled hardware and system architectures.
Excellent communication and collaboration skills, with the ability to work effectively across multidisciplinary teams.
Ability to operate at both system-architecture and detailed board-design levels, take ownership of ambiguous technical problems, make engineering tradeoffs, and deliver production-ready systems.
Culture & Benefits
Onsite work is expected primarily from an HPE office.
Health and wellbeing benefits support physical, financial, and emotional wellbeing.
Personal and professional development programs support career growth and knowledge development.
An inclusive workplace values varied backgrounds and individual uniqueness.
Будьте осторожны: если работодатель просит войти в их систему, используя iCloud/Google, прислать код/пароль, запустить код/ПО, не делайте этого - это мошенники. Обязательно жмите "Пожаловаться" или пишите в поддержку. Подробнее в гайде →