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7 дней назад

Senior Principal Hardware Engineer

181 000 - 367 000$
Формат работы
onsite
Тип работы
fulltime
Грейд
senior
Английский
b2
Страна
US
Вакансия из списка Hirify.GlobalВакансия из Hirify Global, списка международных tech-компаний
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TL;DR
Senior Principal Hardware Engineer (high-speed networking hardware/FPGA): Designing next-generation networking hardware and liquid-cooled scale-up systems from architecture through production with an accent on high-bandwidth signaling, dense high-power PCBs, FPGA integration, and SI/PI analysis. Focus on developing 100G/200G-plus interconnects, solving electrical, thermal, and mechanical constraints, and integrating liquid cooling into high-performance computing and AI/ML architectures.

Location: Onsite in Sunnyvale, California, United States

Base salary: USD 181,000–367,000 annually in California; variable incentives may also be offered.

Company

hirify.global is an edge-to-cloud technology company developing solutions that connect, protect, analyze, and act on data and applications.

What you will do

  • Own the end-to-end hardware design lifecycle from system architecture and concept development through schematic design, PCB layout, bring-up, validation, qualification, and production.
  • Lead high-performance, high-density, high-power circuit-board design with demanding electrical, thermal, and mechanical constraints.
  • Design systems using 100G, 200G, and higher-speed serial signaling and interconnects.
  • Develop and review schematics, power architectures, clocking solutions, high-speed interfaces, and board-level architectures.
  • Design FPGA solutions, including device selection, configuration, interfaces, implementation, bring-up, and hardware/firmware integration.
  • Drive signal integrity and power integrity analysis, liquid-cooled scale-up architectures, and cross-functional solutions with thermal, mechanical, firmware, software, and manufacturing teams.

Requirements

  • 10+ years of hands-on hardware or board-design experience with complex, high-performance electronic systems.
  • 10+ years of experience designing high-speed systems with 100G/200G-class signaling or comparable high-bandwidth interfaces.
  • 10+ years of experience designing high-power, extremely dense PCBs and electronic systems.
  • 10+ years of hands-on FPGA design experience, including independently designing and implementing FPGA-based solutions.
  • 10+ years of strong knowledge of signal integrity and power integrity principles.
  • 10+ years of experience with scale-up systems and high-performance computing, networking, AI/ML, accelerator, or similarly demanding architectures.
  • 10+ years of experience with liquid cooling systems, including liquid-cooled hardware and system architectures.
  • Excellent communication and collaboration skills, with the ability to work effectively across multidisciplinary teams.
  • Ability to operate at both system-architecture and detailed board-design levels, take ownership of ambiguous technical problems, make engineering tradeoffs, and deliver production-ready systems.

Culture & Benefits

  • Onsite work is expected primarily from an HPE office.
  • Health and wellbeing benefits support physical, financial, and emotional wellbeing.
  • Personal and professional development programs support career growth and knowledge development.
  • An inclusive workplace values varied backgrounds and individual uniqueness.

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